Method and system for attaching optical fibers to warped photonic chips

Patent metadata

Field	Value
Publication number	US-2022011529-A1
Application number	US-202117482485-A
Country	US
Kind code	A1
Filing date	Sep 23, 2021
Priority date	Sep 23, 2021
Publication date	Jan 13, 2022
Grant date	—

Abstract

The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

First claim

What is claimed is:

1 . A method comprising:
arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the bent die.

2 . The method of claim 1 , wherein applying the bonding force non-uniformly comprises applying the bonding force at different angles at different locations of the die.

3 . The method of claim 2 , wherein applying the bonding force non-uniformly comprises applying mechanical force.

4 . The method of claim 1 , wherein applying the bonding force non-uniformly comprises applying the bonding force of different strengths at different locations of the die.

5 . The method of claim 4 , wherein applying the bonding force non-uniformly comprises applying air pressure.

6 . The method of claim 1 , wherein the bonding force is applied using multiple bond heads.

7 . The method of claim 6 , wherein the bonding force is applied using freely rotatable multiple bond heads.

8 . The method of claim 6 , wherein the bonding force is applied using non-rotatable multiple bond heads.

9 . The method of claim 8 , wherein the bonding force is applied using resilient multiple bond heads.

10 . The method of claim 9 , wherein the bonding force is applied using hollow multiple bond heads.

11 . A system comprising:
a die, wherein the die is bent and comprises multiple grooves; multiple optical fibers, each optical fiber in or close to a separate groove; a lid over the die and the multiple optical fibers; and a bonding apparatus comprising a bond head section configured to make multiple contact points with the lid to conform the lid to the bent die.

12 . The system of claim 11 , wherein the bond head section comprises multiple bond heads.

13 . The system of claim 12 , wherein each of the multiple bond heads is independently freely rotatable to conform to the bent die.

14 . The system of claim 12 , wherein each of the multiple bond heads is independently controllable by mechanical force or pressure actuators.

15 . The system of claim 14 , wherein each of the multiple bond heads is not rotatable.

16 . The system of claim 15 , wherein each of the multiple bond heads is resilient.

17 . The system of claim 12 , wherein the bond head section is hollow and the multiple bond heads reside inside the hollow bond head section.

18 . The system of claim 17 , wherein the hollow bond head section is air-pressure controlled.

19 . The system of claim 18 , wherein the hollow bond head section comprises pressure seals around edges of the hollow bond head section.

20 . The system of claim 19 , wherein the pressure seals comprise O-ring seals, flange seals, or soft compressible seals.

Assignees

• Intel Corp

Inventors

• Ahmed Sufi
• Abraham Vineeth
• Moret Eric
• Diglio Paul

Classifications

• G02B6/3839

  for a plurality of light guides · CPC title

• G02B6/3636

  the mechanical coupling means being grooves (G02B6/3652 takes precedence) · CPC title

• G02B6/4239 Primary

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/30 Primary

  for use between fibre and thin-film device · CPC title