Electronic module including a semiconductor package disposed on an interposer layer
US-12438063-B2 · Oct 7, 2025 · US
This page is not indexed by search engines while we improve data quality.
Chiola Davide patents
Chiola Davide is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chiola Davide |
| Total patents | 10 |
| First publication | Oct 15, 2015 |
| Latest publication | Oct 7, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
An electronic module including a semiconductor package disposed on an interposer layer
US-2024194566-A1 · Jun 13, 2024 · US
Electronic module including a semiconductor package connected to a fluid heatsink
US-11955407-B2 · Apr 9, 2024 · US
Electronic module including a semiconductor package connected to a fluid heatsink
US-2021225734-A1 · Jul 22, 2021 · US
Baseplate for an electronic module
US-10109544-B2 · Oct 23, 2018 · US
Baseplate for an electronic module and method of manufacturing the same
US-2017287798-A1 · Oct 5, 2017 · US
Method of manufacturing baseplate for an electronic module
US-9716018-B2 · Jul 25, 2017 · US
Baseplate for an electronic module and method of manufacturing the same
US-2016196989-A1 · Jul 7, 2016 · US
Baseplate for an electronic module and method of manufacturing the same
US-9305874-B2 · Apr 5, 2016 · US
Baseplate for an electronic module and method of manufacturing the same
US-2015294931-A1 · Oct 15, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 6 |
| Infineon Technologies Austria Ag | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 10 |
| H10W90/734 | 10 |
| H10W40/255 | 10 |
| H10W40/258 | 10 |
| H01L25/072 | 6 |