Baseplate for an electronic module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016196989-A1
Application number	US-201615070942-A
Country	US
Kind code	A1
Filing date	Mar 15, 2016
Priority date	Apr 13, 2014
Publication date	Jul 7, 2016
Grant date	—

Abstract

Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.

First claim

What is claimed is:

1 . A method of manufacturing a baseplate for an electronic module, the method comprising:
providing a baseplate; forming a recess in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip.

2 . The method according to claim 1 , wherein the recess is formed by one process out of the group consisting of:
drilling; machining; milling; etching; punching; stamping; extruding; cold extruding; and 3D-printing.

3 . The method according to claim 1 wherein the baseplate comprises
a conductive material.

4 . The method according to claim 1 , wherein the electronic module is a power module and the baseplate consists of electrically conductive material.

5 . The method according to claim 1 , wherein forming the recess comprises forming the recess with a depth adapted to fully accommodate the electronic chip.

6 . The method according to claim 1 , wherein the baseplate has a thickness in the range between 2 mm and 10 mm.

7 . The method according to claim 3 , wherein the baseplate comprises a material selected out of the group consisting of:
aluminum; brass; copper; and Metal Matrix Composite.

8 . The method according to claim 1 , further comprising:
forming a contact area in the recess.

9 . A method of manufacturing an electronic module, the method comprising:
manufacturing a baseplate according to claim 1 , and placing an electronic chip in the recess.

10 . The method according to claim 9 , wherein the electronic chip is a pre-packaged dice.

11 . The method according to claim 9 , further comprising attaching the electronic chip to the baseplate.

12 . The method according to claim 11 , further comprising adhering the electronic chip to the baseplate.

13 . The method according to claim 9 , further comprising providing an insulating layer arranged on the one main surface of the baseplate.

14 . The method according to claim 9 , further comprising attaching the electronic chip to a substrate or carrier before placing the electronic chip in the recess.

15 . The method according to claim 9 , further comprising providing a mold compound at least partially encapsulating the baseplate and the electronic chip placed in the recess of the baseplate.

16 . The method according to claim 9 , further comprising providing terminals arranged to contact the electronic chip with an exterior of the electronic module.

17 . The method according to claim 9 , comprising manufacturing a plurality of baseplates according to claim 1 and placing a plurality of electronic chips in the plurality of recesses of the plurality of baseplates.

18 . The method according to claim 17 , further comprising stacking at least two of the plurality of baseplates on top of each other.

19 . The method according to claim 9 , wherein the electronic module is a power module and the baseplate consists of electrically conductive material.

20 . A method of manufacturing an electronic power module, the method comprising:
providing a baseplate consisting of an electrically conductive material; forming a recess in one main surface of the baseplate; and placing an electronic chip in the recess.

Assignees

• Infineon Technologies Ag

Inventors

• Brucchi Fabio
• Chiola Davide

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title