Baseplate for an electronic module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9305874-B2
Application number	US-201414251609-A
Country	US
Kind code	B2
Filing date	Apr 13, 2014
Priority date	Apr 13, 2014
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

Various embodiments provide a baseplate for an electronic module, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.

First claim

What is claimed is:

1. A baseplate for an electronic power module, the baseplate:
consisting of an electrically conductive material; and
comprising a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.

2. The baseplate according to claim 1 , wherein the recess has a depth adapted to fully accommodate the electronic chip.

3. The baseplate according to claim 1 , wherein the baseplate has a thickness in the range between 2 mm and 10 mm.

4. The baseplate according to claim 1 , wherein the baseplate comprises a material selected out of the group consisting of:
aluminum;
brass;
copper; and
Metal Matrix Composite.

5. The baseplate according to claim 1 , wherein in the recess a contact area is formed.

6. An electronic power module, comprising:
a baseplate according to claim 1 , and
an electronic chip placed in the recess.

7. The electronic module according to claim 6 , wherein the electronic chip is a pre-packaged dice.

8. The electronic module according to claim 6 , wherein the electronic chip is attached to the baseplate.

9. The electronic module according to claim 8 , wherein the electronic chip is adhered to the baseplate.

10. The electronic module according to claim 6 , further comprising an insulating layer arranged on the one main surface of the baseplate.

11. The electronic module according to claim 6 , further comprising a mold compound at least partially encapsulating the baseplate and the electronic chip placed in the recess of the baseplate.

12. The electronic module according to claim 6 , further comprising terminals arranged to contact the electronic chip with an exterior of the electronic module.

13. The electronic module according to claim 6 , comprising a plurality of baseplates according to claim 1 and a plurality of electronic chips placed in the plurality of recesses of the plurality of baseplates.

14. The electronic module according to claim 13 , wherein at least two of the plurality of baseplates are stacked on top of each other.

Assignees

• Infineon Technologies Ag

Inventors

• Brucchi Fabio
• Chiola Davide

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title