Method of manufacturing baseplate for an electronic module

Patent metadata

Field	Value
Publication number	US-9716018-B2
Application number	US-201615070942-A
Country	US
Kind code	B2
Filing date	Mar 15, 2016
Priority date	Apr 13, 2014
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

Various embodiments provide methods for manufacturing a baseplate for an electronic module and an electronic module comprising a baseplate, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.

First claim

What is claimed is:

1. A method of manufacturing an electronic module, the method comprising:
providing a baseplate;
forming a recess in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip,
attaching the electronic chip to a substrate or carrier before placing the electronic chip in the recess, and
placing the electronic chip in the recess.

2. The method according to claim 1 , wherein the electronic chip is a pre-packaged dice.

3. The method according to claim 1 , further comprising attaching the electronic chip to the baseplate.

4. The method according to claim 3 , further comprising adhering the electronic chip to the baseplate.

5. The method according to claim 1 , further comprising providing an insulating layer arranged on the one main surface of the baseplate.

6. The method according to claim 1 , further comprising providing a mold compound at least partially encapsulating the baseplate and the electronic chip placed in the recess of the baseplate.

7. The method according to claim 1 , further comprising providing terminals arranged to contact the electronic chip with an exterior of the electronic module.

8. The method according to claim 1 , comprising manufacturing a plurality of baseplates each having formed therein a recess in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip and placing a plurality of electronic chips in the plurality of recesses of the plurality of baseplates.

9. The method according to claim 8 , further comprising stacking at least two of the plurality of baseplates on top of each other.

10. The method according to claim 1 , wherein the electronic module is a power module and the baseplate consists of electrically conductive material.

11. A method of manufacturing an electronic power module, the method comprising:
providing a baseplate consisting of an electrically conductive material;
forming a recess in one main surface of the baseplate;
attaching an electronic chip to a substrate or carrier before placing the electronic chip in the recess; and
placing the electronic chip in the recess.

12. The method according to claim 1 , wherein the recess is formed by one process out of the group consisting of:
drilling;
machining;
milling;
etching;
punching;
stamping;
extruding;
cold extruding; and
3D-printing.

13. The method according to claim 1 wherein the baseplate comprises a conductive material.

14. The method according to claim 1 , wherein the electronic module is a power module and the baseplate consists of electrically conductive material.

15. The method according to claim 1 , wherein forming the recess comprises forming the recess with a depth adapted to fully accommodate the electronic chip.

16. The method according to claim 1 , wherein the baseplate has a thickness in the range between 2 mm and 10 mm.

17. The method according to claim 13 , wherein the baseplate comprises a material selected out of the group consisting of:
aluminum;
brass;
copper; and
Metal Matrix Composite.

18. The method according to claim 1 , further comprising:
forming a contact area in the recess.

Assignees

• Infineon Technologies Ag

Inventors

• Brucchi Fabio
• Chiola Davide

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title