Baseplate for an electronic module

Patent metadata

Field	Value
Publication number	US-10109544-B2
Application number	US-201715630750-A
Country	US
Kind code	B2
Filing date	Jun 22, 2017
Priority date	Apr 13, 2014
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip. The electronic chip is attached to a substrate or carrier and is placed in the recess.

First claim

What is claimed is:

1. An electronic module, the electronic module comprising:
a baseplate;
a recess being formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip,
the electronic chip being attached to a substrate or carrier;
the electronic chip being placed in the recess; and
an insulating layer arranged on the one main surface of the baseplate, wherein the insulating layer is a thin layer or foil of an insulator material.

2. The electronic module according to claim 1 , wherein the electronic chip is a pre-packaged dice.

3. The electronic module according to claim 1 , the electronic chip being attached to the baseplate.

4. The electronic module according to claim 1 , the electronic chip being adhered to the baseplate.

5. The electronic module according to claim 1 , further comprising a mold compound at least partially encapsulating the baseplate and the electronic chip placed in the recess of the baseplate.

6. The electronic module according to claim 1 , further comprising at least one terminal arranged to contact the electronic chip with an exterior of the electronic module.

7. The electronic module according to claim 1 , comprising a plurality of baseplates each having formed therein a recess in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip; and a plurality of electronic chips being placed in the plurality of recesses of the plurality of baseplates.

8. The electronic module according to claim 7 , further comprising at least two of the plurality of baseplates stacked on top of each other.

9. The electronic module according to claim 1 , wherein the electronic module is a power module and the baseplate consists of electrically conductive material.

10. The electronic module according to claim 1 , wherein the recess is a recess being formed by one process out of the group consisting of:
drilling;
machining;
milling;
etching;
punching;
stamping;
extruding;
cold extruding; and
3D-printing.

11. The electronic module according to claim 1 wherein the baseplate comprises
a conductive material.

12. The electronic module according to claim 1 , the recess being formed with a depth adapted to fully accommodate the electronic chip.

13. The electronic module according to claim 1 , wherein the baseplate has a thickness in the range between 2 mm and 10 mm.

14. The electronic module according to claim 11 , wherein the baseplate comprises a material selected out of the group consisting of:
aluminum;
brass;
copper; and
Metal Matrix Composite.

15. The electronic module according to claim 1 , further comprising:
a contact area being formed in the recess.

16. An electronic power module, the electronic power module comprising:
a baseplate consisting of an electrically conductive material;
a recess being formed in one main surface of the baseplate;
an electronic chip being attached to a substrate or carrier;
the electronic chip being placed in the recess; and
an insulating layer arranged on the one main surface of the baseplate, wherein the insulating layer is a thin layer or foil of an insulator material.

17. The electronic module according to claim 1 , further comprising:
terminals for electrically contacting the electronic chip, the terminals projecting out of the thin layer or foil.

18. The electronic power module according to claim 16 , further comprising:
terminals for electrically contacting the electronic chip, the terminals projecting out of the thin layer or foil.

Assignees

• Infineon Technologies Ag

Inventors

• Brucchi Fabio
• Chiola Davide

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title