Dual micro-electro mechanical system and manufacturing method thereof
US-12595167-B2 · Apr 7, 2026 · US
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Chen Yang-Che patents
Chen Yang-Che is listed as an inventor on 76 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Yang-Che |
| Total patents | 76 |
| First publication | May 21, 2015 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and bonding failure test method thereof
US-2026082869-A1 · Mar 19, 2026 · US
Bond shift detection for bonded substrates
US-2026068611-A1 · Mar 5, 2026 · US
Galvanic effect monitor test structure for ic package interposer
US-2026026314-A1 · Jan 22, 2026 · US
Semiconductor structure and method of manufacturing the same
US-2025359082-A1 · Nov 20, 2025 · US
Delamination detection structure
US-2025357320-A1 · Nov 20, 2025 · US
Semiconductor structure and method of manufacturing the same
US-12426283-B2 · Sep 23, 2025 · US
Semiconductor die and wafer bonding crack detector structures and methods of forming same
US-2025239495-A1 · Jul 24, 2025 · US
Semiconductor device and method for fabricating the same
US-2025233026-A1 · Jul 17, 2025 · US
Method of testing semiconductor package
US-2025174499-A1 · May 29, 2025 · US
Recent patents
Latest publications not already listed above.
Delamination detection structure
US-2025140684-A1 · May 1, 2025 · US
Semiconductor device with enhanced thermal dissipation and method for making the same
US-2025087553-A1 · Mar 13, 2025 · US
Method of testing semiconductor package
US-12243788-B2 · Mar 4, 2025 · US
Forming a cavity in a redistribution layer of an ic package to reduce overspreading of underfill material
US-2025054934-A1 · Feb 13, 2025 · US
Semiconductor structure including crack detector and manufacturing method thereof
US-2025046702-A1 · Feb 6, 2025 · US
Semiconductor structure with daisy chain and a method of manufacturing the same
US-2025015034-A1 · Jan 9, 2025 · US
Semiconductor device with enhanced thermal dissipation and method for making the same
US-12183655-B2 · Dec 31, 2024 · US
Semiconductor package structure and method for forming the same
US-2024363576-A1 · Oct 31, 2024 · US
Semiconductor package and method for making the same
US-2024312851-A1 · Sep 19, 2024 · US
Dual micro-electro mechanical system and manufacturing method thereof
US-2024262681-A1 · Aug 8, 2024 · US
Inductor structure and method for manufacturing the same
US-2024243163-A1 · Jul 18, 2024 · US
Semiconductor package and method for making the same
US-12027433-B2 · Jul 2, 2024 · US
Dual micro-electro mechanical system and manufacturing method thereof
US-11993512-B2 · May 28, 2024 · US
Inductive device
US-11908884-B2 · Feb 20, 2024 · US
Semiconductor package structure and method for manufacturing the same
US-2024047310-A1 · Feb 8, 2024 · US
Method of manufacturing a semiconductor device and a semiconductor device
US-2024047384-A1 · Feb 8, 2024 · US
Semiconductor structure and method of manufacturing the same
US-2024038828-A1 · Feb 1, 2024 · US
Method for detecting defects in semiconductor device
US-11854913-B2 · Dec 26, 2023 · US
Semiconductor package structure and method for manufacturing the same
US-11837526-B2 · Dec 5, 2023 · US
Inductive device
US-2023387182-A1 · Nov 30, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 75 |
| Taiwan Semiconductor Mfg Company Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 37 |
| H10W74/117 | 35 |
| H10W90/00 | 28 |
| H10W90/724 | 27 |
| H10W74/15 | 25 |