Removing polymer through treatment
US-12272595-B2 · Apr 8, 2025 · US
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Chen Hung-Hao patents
Chen Hung-Hao is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Hung-Hao |
| Total patents | 27 |
| First publication | May 31, 2016 |
| Latest publication | Apr 8, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and method of manufacture
US-11776853-B2 · Oct 3, 2023 · US
Semiconductor Device and Method of Manufacture
US-2022130729-A1 · Apr 28, 2022 · US
Removing Polymer Through Treatment
US-2022059403-A1 · Feb 24, 2022 · US
Semiconductor device and method of manufacture
US-11217485-B2 · Jan 4, 2022 · US
Method for forming semiconductor device structure with fine line pitch and fine end-to-end space
US-11217458-B2 · Jan 4, 2022 · US
Removing polymer through treatment
US-11171040-B2 · Nov 9, 2021 · US
Removing polymer through treatment
US-10854505-B2 · Dec 1, 2020 · US
MIM capacitor with top electrode having footing profile and method forming same
US-10825892-B2 · Nov 3, 2020 · US
Method for Forming Semiconductor Device Structure with Fine Line Pitch and Fine End-To-End Space
US-2020303204-A1 · Sep 24, 2020 · US
Recent patents
Latest publications not already listed above.
Method for forming semiconductor device structure with fine line pitch and fine end-to-end space
US-10679863-B2 · Jun 9, 2020 · US
Etching Process Control in Forming MIM Capacitor
US-2020152731-A1 · May 14, 2020 · US
Semiconductor Device and Method of Manufacture
US-2020152516-A1 · May 14, 2020 · US
Etching process control in forming MIM capacitor
US-10541298-B2 · Jan 21, 2020 · US
Etching process control in forming MIM capacitor
US-10535727-B2 · Jan 14, 2020 · US
Semiconductor device and method of manufacture
US-10535566-B2 · Jan 14, 2020 · US
Etching Process Control in Forming MIM Capacitor
US-2019333984-A1 · Oct 31, 2019 · US
Removing Polymer Through Treatment
US-2019096747-A1 · Mar 28, 2019 · US
Etching Process Control in Forming MIM Capacitor
US-2018301526-A1 · Oct 18, 2018 · US
Etching process control in forming MIM capacitor
US-10008559-B2 · Jun 26, 2018 · US
Method for Forming Semiconductor Device Structure with Fine Line Pitch and Fine End-To-End Space
US-2017365488-A1 · Dec 21, 2017 · US
Semiconductor Device and Method of Manufacture
US-2017316981-A1 · Nov 2, 2017 · US
Removing Polymer Through Treatment
US-2017278742-A1 · Sep 28, 2017 · US
Etching Process Control in Forming MIM Capacitor
US-2017278921-A1 · Sep 28, 2017 · US
Method for forming semiconductor device structure with fine line pitch and fine end-to-end space
US-9735028-B2 · Aug 15, 2017 · US
Method for forming semiconductor device structure with fine line pitch and fine end-to-end space
US-2016268143-A1 · Sep 15, 2016 · US
Method for preventing extreme low-K (ELK) dielectric layer from being damaged during plasma process
US-9355893-B1 · May 31, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 30 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/081 | 13 |
| H10P50/73 | 13 |
| H10W20/088 | 13 |
| H10W20/087 | 13 |
| H01L21/31116 | 12 |