Semiconductor device and methods of formation
US-2026068644-A1 · Mar 5, 2026 · US
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Chang Chih-Yi patents
Chang Chih-Yi is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chang Chih-Yi |
| Total patents | 23 |
| First publication | Dec 8, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor interconnection structures and manufacturing method thereof
US-2025385175-A1 · Dec 18, 2025 · US
Conductive features of semiconductor device and method of forming same
US-2025323161-A1 · Oct 16, 2025 · US
Via for semiconductor device and method
US-2025279364-A1 · Sep 4, 2025 · US
Conductive Structures and Dielectric Structures in Interconnect Structures
US-2025246551-A1 · Jul 31, 2025 · US
Interconnect structure including graphite and method forming same
US-12334397-B2 · Jun 17, 2025 · US
Graphene liners and caps for semiconductor structures
US-2025192052-A1 · Jun 12, 2025 · US
Via for semiconductor device and method
US-12315809-B2 · May 27, 2025 · US
Graphene liners and caps for semiconductor structures
US-12255144-B2 · Mar 18, 2025 · US
Conductive features of semiconductor device and method of forming same
US-2025062232-A1 · Feb 20, 2025 · US
Recent patents
Latest publications not already listed above.
Interconnect structure including graphite and method forming same
US-2024379430-A1 · Nov 14, 2024 · US
Via for semiconductor device and method
US-2023369224-A1 · Nov 16, 2023 · US
Via for semiconductor device and method
US-11810857-B2 · Nov 7, 2023 · US
Graphene liners and caps for semiconductor structures
US-2023154850-A1 · May 18, 2023 · US
Interconnect structure of semiconductor device
US-11527476-B2 · Dec 13, 2022 · US
Interconnect Structure Including Graphite and Method Forming Same
US-2022367266-A1 · Nov 17, 2022 · US
Interconnect structure of semiconductor device
US-2022084937-A1 · Mar 17, 2022 · US
Via for semiconductor device and method
US-2022068826-A1 · Mar 3, 2022 · US
Metal cap apparatus and method
US-9786604-B2 · Oct 10, 2017 · US
Systems and methods of compensating for filling material losses in electroplating processes
US-9632498-B2 · Apr 25, 2017 · US
Electro chemical plating process
US-9476135-B2 · Oct 25, 2016 · US
Metal Cap Apparatus and Method
US-2016064332-A1 · Mar 3, 2016 · US
Metal cap apparatus and method
US-9209073-B2 · Dec 8, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 23 |
| Taiwan Semiconductor Mfg | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/425 | 17 |
| H10W20/056 | 15 |
| H01L23/53238 | 13 |
| H10W20/42 | 13 |
| H01L23/5226 | 11 |