Metal or metal alloy deposition composition and plating compound
US-11512405-B2 · Nov 29, 2022 · US
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Brunner Heiko patents
Brunner Heiko is listed as an inventor on 31 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Brunner Heiko |
| Total patents | 31 |
| First publication | Feb 24, 2015 |
| Latest publication | Nov 29, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
US-11091849-B2 · Aug 17, 2021 · US
Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
US-11066553-B2 · Jul 20, 2021 · US
Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
US-10882842-B2 · Jan 5, 2021 · US
Metal or metal alloy deposition composition and plating compound
US-2020340132-A1 · Oct 29, 2020 · US
Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
US-10767275-B2 · Sep 8, 2020 · US
Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
US-2020231565-A1 · Jul 23, 2020 · US
A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
US-2020199766-A1 · Jun 25, 2020 · US
Electrolytic copper plating bath compositions and a method for their use
US-10538850-B2 · Jan 21, 2020 · US
Plating bath composition and method for electroless plating of palladium
US-10513780-B2 · Dec 24, 2019 · US
Recent patents
Latest publications not already listed above.
Method for providing a multilayer coating on a surface of a substrate
US-2019264328-A1 · Aug 29, 2019 · US
Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
US-2019144667-A1 · May 16, 2019 · US
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
US-10219391-B2 · Feb 26, 2019 · US
Plating bath composition and method for electroless plating of palladium
US-2018340260-A1 · Nov 29, 2018 · US
Plating bath composition and method for electroless plating of palladium
US-2018340261-A1 · Nov 29, 2018 · US
Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
US-2018223442-A1 · Aug 9, 2018 · US
Electrolytic copper plating bath compositions and a method for their use
US-2018112320-A1 · Apr 26, 2018 · US
Plating bath compositions for electroless plating of metals and metal alloys
US-9909216-B2 · Mar 6, 2018 · US
Plating bath compositions for electroless plating of metals and metal alloys
US-2017327954-A1 · Nov 16, 2017 · US
3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths
US-9790607-B1 · Oct 17, 2017 · US
Galvanic nickel electroplating bath for depositing a semi-bright nickel
US-9752244-B2 · Sep 5, 2017 · US
Solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound
US-2017086305-A1 · Mar 23, 2017 · US
Copper plating bath composition
US-9551080-B2 · Jan 24, 2017 · US
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
US-9504161-B2 · Nov 22, 2016 · US
Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
US-9399824-B2 · Jul 26, 2016 · US
Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths
US-9322107-B2 · Apr 26, 2016 · US
Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
US-2016053395-A1 · Feb 25, 2016 · US
Plating bath for electroless deposition of nickel layers
US-9175399-B2 · Nov 3, 2015 · US
Copper plating bath composition
US-2015299883-A1 · Oct 22, 2015 · US
Plating bath for electroless deposition of nickel layers
US-2015110965-A1 · Apr 23, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Atotech Deutschland Gmbh | 31 |
| Brunner Heiko | 2 |
| Kohlmann Lars | 1 |
| Habig Ellen | 1 |
| Dingwerth Bjorn | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.