Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

Patent metadata

Field	Value
Publication number	US-11091849-B2
Application number	US-201816635568-A
Country	US
Kind code	B2
Filing date	Sep 13, 2018
Priority date	Sep 13, 2017
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprisinga source of nickel ions, and optionally a source of ions of at least one alloying metal,at least one buffering agent,at least one of a dimer of a compound of formula (I) or mixtures thereofwhereinR1 is a substituted or unsubstituted alkenyl group,R2 may be present or not, and if present R2 is a —(CH2)n—SO3− group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; anda method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.

First claim

The invention claimed is:

1. An aqueous bath comprising
a source of nickel ions, and optionally a source of ions of at least one alloying metal,
at least one buffering agent,
at least one of a dimer of a compound of formula (I) or mixtures thereof

wherein
R 1 is a substituted or unsubstituted alkenyl group,
R 2 may be present or not, so that the nitrogen may be positively charged or not, and R 2 , if present, is a —(CH 2 ) n —SO 3 − group, wherein n is an integer in the range of 1-6, wherein one or more of the hydrogens in the —(CH 2 ) n —SO 3 − group may be replaced by a substituent,
wherein the at least one of a dimer of a compound of formula (I) or mixtures thereof comprises a compound of formula (II)

2. The aqueous bath of claim 1 , wherein the total concentration of the at least one of a dimer is 1-10000 mg/L.

3. The aqueous bath of claim 1 , wherein the alloying metal is selected from cobalt or iron or a combination thereof.

4. An aqueous bath comprising
a source of nickel ions, and optionally a source of ions of at least one alloying metal,
at least one buffering agent,
at least one of a dimer of a compound of formula (I) or mixtures thereof

wherein
R 1 is a substituted or unsubstituted alkenyl group,
R 2 may be present or not, so that the nitrogen may be positively charged or not, and R 2 , if present, is a —(CH 2 ) n —SO 3 − group, wherein n is an integer in the range of 1-6, wherein one or more of the hydrogens in the —(CH 2 ) n —SO 3 − group may be replaced by a substituent,
wherein the compound of formula (I) comprises a compound of formula (III)

5. The aqueous bath of claim 4 , wherein the dimer of the compound of formula (III) is a compound of formula (IV)

6. The aqueous bath of claim 4 , wherein the total concentration of the at least one of a dimer is 1-10000 mg/L.

7. The aqueous bath of claim 4 , wherein the alloying metal is selected from cobalt or iron or a combination thereof.

8. A compound of formula (II)

wherein R 2 is a —(CH 2 ) n —SO 3 − group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the —(CH 2 ) n —SO 3 − group may be replaced by a substituent.

9. The compound of claim 8 , which is a compound of formula (IV)

Assignees

• Atotech Deutschland Gmbh

Inventors

• Gaida Josef
• Sperling Jan
• Castellani Mauro
• Vazhenin Grigory
• Ackermann Stefanie
• Brunner Heiko
• Rohde Dirk

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• H05K2203/0786

  Using an aqueous solution, e.g. for cleaning or during drilling of holes · CPC title

• H05K3/421

  Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence) · CPC title

• H05K3/423

  characterised by electroplating method · CPC title

• C25D3/12 Primary

  of nickel or cobalt · CPC title