Ion beam etching with sidewall cleaning
US-12302760-B2 · May 13, 2025 · US
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Berry Iii Ivan L patents
Berry Iii Ivan L is listed as an inventor on 53 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Berry Iii Ivan L |
| Total patents | 53 |
| First publication | Nov 5, 2015 |
| Latest publication | May 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Ion beam etching with sidewall cleaning
US-2024315141-A1 · Sep 19, 2024 · US
Ion beam etching with sidewall cleaning
US-12029133-B2 · Jul 2, 2024 · US
Electron excitation atomic layer etch
US-2023298904-A1 · Sep 21, 2023 · US
Electron excitation atomic layer etch
US-11637022-B2 · Apr 25, 2023 · US
Predicting etch characteristics in thermal etching and atomic layer etching
US-11520953-B2 · Dec 6, 2022 · US
Plasma etch tool for high aspect ratio etching
US-2022165546-A1 · May 26, 2022 · US
Ion beam etching with sidewall cleaning
US-2022131071-A1 · Apr 28, 2022 · US
Ion beam etching utilizing cryogenic wafer temperatures
US-11289306-B2 · Mar 29, 2022 · US
Method and apparatus for processing wafer-shaped articles
US-11195730-B2 · Dec 7, 2021 · US
Recent patents
Latest publications not already listed above.
Electron excitation atomic layer etch
US-2021280433-A1 · Sep 9, 2021 · US
Ion injector and lens system for ion beam milling
US-11062920-B2 · Jul 13, 2021 · US
Ion beam etch without need for wafer tilt or rotation
US-10998167-B2 · May 4, 2021 · US
Ion beam etch without need for wafer tilt or rotation
US-10825652-B2 · Nov 3, 2020 · US
Isotropic atomic layer etch for silicon oxides using no activation
US-10679868-B2 · Jun 9, 2020 · US
Differentially pumped reactive gas injector
US-10580628-B2 · Mar 3, 2020 · US
Method and apparatus for processing wafer-shaped articles
US-10490426-B2 · Nov 26, 2019 · US
Use of ion beam etching to generate gate-all-around structure
US-10483085-B2 · Nov 19, 2019 · US
Predicting etch characteristics in thermal etching and atomic layer etching
US-2019340316-A1 · Nov 7, 2019 · US
Ion beam etch without need for wafer tilt or rotation
US-2019237298-A1 · Aug 1, 2019 · US
Systems and methods for patterning of high density standalone mram devices
US-2018233662-A1 · Aug 16, 2018 · US
Ion injector and lens system for ion beam milling
US-2018166304-A1 · Jun 14, 2018 · US
Apparatus for achieving ultra-high selectivity while etching silicon nitride
US-2018158692-A1 · Jun 7, 2018 · US
Ion injector and lens system for ion beam milling
US-9916993-B2 · Mar 13, 2018 · US
Method for achieving ultra-high selectivity while etching silicon nitride
US-9911620-B2 · Mar 6, 2018 · US
Differentially pumped reactive gas injector
US-2018047548-A1 · Feb 15, 2018 · US
Ion beam etching utilizing cryogenic wafer temperatures
US-2017372911-A1 · Dec 28, 2017 · US
Differentially pumped reactive gas injector
US-9837254-B2 · Dec 5, 2017 · US
Control Of The Incidence Angle Of An Ion Beam On A Substrate
US-2017330788-A1 · Nov 16, 2017 · US
Control of the incidence angle of an ion beam on a substrate
US-9812349-B2 · Nov 7, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 50 |
| Lam Res Ag | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/242 | 30 |
| H10P50/283 | 24 |
| H10P72/0421 | 22 |
| H01L21/3065 | 21 |
| H01L21/67069 | 20 |