Method and apparatus for processing wafer-shaped articles

Patent metadata

Field	Value
Publication number	US-11195730-B2
Application number	US-201916692948-A
Country	US
Kind code	B2
Filing date	Nov 22, 2019
Priority date	Aug 26, 2014
Publication date	Dec 7, 2021
Grant date	Dec 7, 2021

Abstract

A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.

First claim

What is claimed is:

1. Device for processing wafer-shaped articles, comprising
a process chamber defining an enclosure,
a rotary chuck located within said process chamber, said rotary chuck being adapted to hold a water-shaped article of a predetermined diameter thereon,
a stationary heater positioned to face an underside of a wafer-shaped article placed on said rotary chuck so as to heat a wafer-shaped article held on said rotary chuck from the underside of the wafer-shaped article and without contacting the wafer-shaped article,
said stationary heater emitting radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm, and
at least one first liquid dispenser positioned relative to said rotary chuck so as to dispense a process liquid onto a side of the wafer-shaped article that is opposite the side of the wafer-shaped article facing the stationary heater.

2. The device according to claim 1 , wherein said rotary chuck is driven by a motor whose output is transmitted to a rotary shaft connected to said rotary chuck.

3. The device according to claim 1 , wherein said stationary heater emits radiation having a maximum intensity in a wavelength range from 400 nm to 500 nm.

4. The device according to claim 1 , wherein said stationary heater comprises an array of blue light-emitting diodes.

5. The device according to claim 1 , wherein the stationary heater includes an array of heating elements, which is substantially coextensive with the wafer-shaped article of said predetermined diameter.

6. The device according to claim 1 , further comprising a first plate between said stationary heater and the wafer-shaped article when held on said rotary chuck, said first plate being substantially transparent to radiation emitted by said stationary heater.

7. The device according to claim 6 , wherein said first plate is made of quartz or sapphire.

8. The device according to claim 6 , further comprising a second plate, the second plate located above the wafer-shaped article and rotating with the rotary chuck.

9. The device according to claim 1 , further comprising at least one second liquid dispenser mounted on a same side of the wafer-shaped article as said stationary heater.

10. The device according to claim 1 , wherein said stationary heater is configured to heat the wafer-shaped article of said predetermined diameter to a temperature in excess of 300° C.

Assignees

• Lam Res Ag

Inventors

• Obweger Rainer
• Gleissner Andreas
• Wirnsberger Thomas
• Kumnig Franz
• Baldaro Alessandro
• Fischer Christian Thomas
• Chou Mu Hung
• Dylewicz Rafal Ryszard
• Lavdovsky Nathan
• Berry Iii Ivan L

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P50/287

  by chemical means · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title