Apparatus for substrate processing
US-12532683-B2 · Jan 20, 2026 · US
This page is not indexed by search engines while we improve data quality.
Asako Ryuichi patents
Asako Ryuichi is listed as an inventor on 50 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Asako Ryuichi |
| Total patents | 50 |
| First publication | Mar 2, 2017 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Pattern formation method
US-2026003261-A1 · Jan 1, 2026 · US
Mask pattern formation method and substrate processing method
US-2026003263-A1 · Jan 1, 2026 · US
Methods for forming vertically layered ionic liquid crystal (ILC) structures on a semiconductor substrate
US-12444606-B2 · Oct 14, 2025 · US
Substrate processing method and substrate processing system
US-12417928-B2 · Sep 16, 2025 · US
Vacuum processing apparatus and oxidizing gas removal method
US-12406862-B2 · Sep 2, 2025 · US
Pattern formation method and photosensitive hard mask
US-12379653-B2 · Aug 5, 2025 · US
Method for observing surface
US-2025231116-A1 · Jul 17, 2025 · US
Substrate processing method and substrate processing system
US-2025191910-A1 · Jun 12, 2025 · US
Substrate processing apparatus
US-2025174439-A1 · May 29, 2025 · US
Recent patents
Latest publications not already listed above.
Methods for forming vertically layered ionic liquid crystal (ilc) structures on a semiconductor substrate
US-2025157820-A1 · May 15, 2025 · US
Pattern forming method and plasma processing method
US-2024318014-A1 · Sep 26, 2024 · US
Substrate processing method and ionic liquid
US-12011738-B2 · Jun 18, 2024 · US
Vacuum processing apparatus and oxidizing gas removal method
US-2024087916-A1 · Mar 14, 2024 · US
Etching method and plasma processing apparatus
US-11842900-B2 · Dec 12, 2023 · US
Substrate processing method and substrate processing system
US-2023230855-A1 · Jul 20, 2023 · US
Substrate processing method and ionic liquid
US-2023226571-A1 · Jul 20, 2023 · US
Purification processing apparatus, substrate processing system, and processing method
US-2023111710-A1 · Apr 13, 2023 · US
Pattern formation method and photosensitive hard mask
US-2023019943-A1 · Jan 19, 2023 · US
Apparatus for substrate processing
US-2023010069-A1 · Jan 12, 2023 · US
Substrate processing method and substrate processing apparatus
US-2023010867-A1 · Jan 12, 2023 · US
Substrate processing method and substrate processing system
US-11538693-B2 · Dec 27, 2022 · US
Vacuum processing apparatus and oxidizing gas removal method
US-2022403509-A1 · Dec 22, 2022 · US
Apparatus for substrate processing
US-11488836-B2 · Nov 1, 2022 · US
Substrate processing method and substrate processing system
US-11456184-B2 · Sep 27, 2022 · US
Etching method and plasma processing apparatus
US-2021366724-A1 · Nov 25, 2021 · US
Substrate processing method and substrate processing system
US-2021125837-A1 · Apr 29, 2021 · US
Plasma processing method
US-10923332-B2 · Feb 16, 2021 · US
Method for etching organic region
US-10903085-B2 · Jan 26, 2021 · US
Apparatus for substrate processing
US-2020381265-A1 · Dec 3, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 50 |
| Univ Kyoto | 1 |
| Tokyo Inst Tech | 1 |
| Nat Univ Corporation Okayama Univ | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/73 | 27 |
| H10P50/283 | 24 |
| H10P14/683 | 18 |
| H01L21/31144 | 18 |
| H10P50/242 | 18 |