Joined body production method, joined body, and hot-melt adhesive sheet
US-12532764-B2 · Jan 20, 2026 · US
This page is not indexed by search engines while we improve data quality.
Abe Tomoyuki patents
Abe Tomoyuki is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Abe Tomoyuki |
| Total patents | 35 |
| First publication | Oct 8, 2015 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Connection body and method for manufacturing connection body
US-12418130-B2 · Sep 16, 2025 · US
Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheet
US-2025250466-A1 · Aug 7, 2025 · US
Method for manufacturing smart card
US-12312514-B2 · May 27, 2025 · US
Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
US-2024279434-A1 · Aug 22, 2024 · US
Joined body production method, joined body, and hot-melt adhesive sheet
US-2023307252-A1 · Sep 28, 2023 · US
Method for manufacturing joined body, joined body, and hot-melt adhesive sheet
US-2023287246-A1 · Sep 14, 2023 · US
Connection body and method for manufacturing connection body
US-2023198186-A1 · Jun 22, 2023 · US
Fabrication method for loop heat pipe
US-11536518-B2 · Dec 27, 2022 · US
Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheet
US-2022363953-A1 · Nov 17, 2022 · US
Recent patents
Latest publications not already listed above.
Metal-clad laminated board, metal member provided with resin, and wiring board
US-11330710-B2 · May 10, 2022 · US
Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board
US-11267225-B2 · Mar 8, 2022 · US
Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
US-11078361-B2 · Aug 3, 2021 · US
Loop heat pipe and fabrication method therefor, and electronic device
US-2021080192-A1 · Mar 18, 2021 · US
Metal-clad laminated board, metal member provided with resin, and wiring board
US-2021014967-A1 · Jan 14, 2021 · US
Loop heat pipe and fabrication method therefor, and electronic device
US-10881021-B2 · Dec 29, 2020 · US
Loop heat pipe and manufacturing method for loop heat pipe and electronic device
US-10624238-B2 · Apr 14, 2020 · US
Chip transfer member, chip transfer apparatus, and chip transfer method
US-10566219-B2 · Feb 18, 2020 · US
Double-sided black adhesive tape
US-10557063-B2 · Feb 11, 2020 · US
Loop heat pipe, manufacturing method thereof, and electronic device
US-10420253-B2 · Sep 17, 2019 · US
Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board
US-2019270280-A1 · Sep 5, 2019 · US
Chip transfer member, chip transfer apparatus, and chip transfer method
US-2019252219-A1 · Aug 15, 2019 · US
Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
US-2019203045-A1 · Jul 4, 2019 · US
Loop heat pipe and manufacturing method for loop heat pipe and electronic device
US-2019090386-A1 · Mar 21, 2019 · US
Loop heat pipe, manufacturing method thereof, and electronic device
US-2019075682-A1 · Mar 7, 2019 · US
Loop heat pipe and fabrication method therefor, and electronic device
US-2018177077-A1 · Jun 21, 2018 · US
Seat structure of vehicle
US-9783087-B2 · Oct 10, 2017 · US
Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board
US-9775239-B2 · Sep 26, 2017 · US
Base station and scheduling method
US-2017245269-A1 · Aug 24, 2017 · US
Video game processing apparatus and video game processing program
US-9710974-B2 · Jul 18, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dexerials Corp | 11 |
| Panasonic Ip Man Co Ltd | 10 |
| Fujitsu Ltd | 9 |
| Toshiba Electronic Devices & Storage Corp | 2 |
| Ayumi Industries Company Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09J2301/408 | 10 |
| B32B2457/08 | 8 |
| C09J7/10 | 8 |
| H10W40/73 | 8 |
| H05K7/20336 | 8 |