Loop heat pipe and manufacturing method for loop heat pipe and electronic device

Patent metadata

Field	Value
Publication number	US-10624238-B2
Application number	US-201816196007-A
Country	US
Kind code	B2
Filing date	Nov 20, 2018
Priority date	May 23, 2016
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

A loop heat pipe includes an evaporator; a condenser; a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein the evaporator, the condenser, the first pipe, and the second pipe is joined to a first tabular and a second tabular, respectively, the first tabular includes a first recessed section in a region to be formed as the evaporator and a region to be formed as a condensation pipe configuring the condenser and the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe.

First claim

What is claimed is:

1. A loop heat pipe comprising:
an evaporator;
a condenser;
a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and
a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein
the evaporator, the condenser, the first pipe, and the second pipe is configured to join a first tabular and a second tabular,
the first tabular includes a first recessed section in a region to be formed as the evaporator, a region to be formed as a condensation pipe configuring the condenser, a region to be formed as the first pipe, and a region to be formed as the second pipe and includes, in the region to be formed as the evaporator, grooves capable of generating a capillary force,
the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe, the region to be formed as the first pipe, and the region to be formed as the second pipe, and
a porous structure is provided in the entire second recessed section.

2. The loop heat pipe according to claim 1 , wherein the first tabular includes, as the grooves, a plurality of grooves extending in a width direction crossing a length direction directed from a side to which the second pipe is connected toward a side to which the first pipe is connected.

3. The loop heat pipe according to claim 1 , wherein the first tabular includes, as the grooves, a plurality of grooves extending in a length direction directed from a side to which the second pipe is connected toward a side to which the first pipe is connected.

4. The loop heat pipe according to claim 1 , wherein
the evaporator includes a comb teeth-like portion divided and extending from a side to which the second pipe is connected, the liquid-phase working fluid penetrating into the comb teeth-like portion to change to the vapor-phase working fluid, and a comb teeth-like vapor channel provided to be opposed to the comb teeth-like portion and divided and extending from a side to which the first pipe is connected, the vapor-phase working fluid flowing in the comb teeth-like vapor channel, and
the first tabular includes the grooves in a region to be formed as the comb teeth-like portion and includes the first recessed section in a region to be formed as the comb teeth-like vapor channel.

5. The loop heat pipe according to claim 4 , wherein the first tabular includes, in a region to be formed as a divided plurality of portions of the comb teeth-like portion, communication grooves that cause adjacent two vapor channels among a divided plurality of vapor channels of the comb teeth-like vapor channels to communicate.

6. The loop heat pipe according to claim 4 , wherein, in the comb teeth-like vapor channel, a channel width of each of a divided plurality of vapor channels is larger than width of the grooves.

7. The loop heat pipe according to claim 1 , wherein the first tabular includes a column in the first recessed section.

8. The loop heat pipe according to claim 1 , wherein the first tabular includes, in the region to be formed as the second pipe, second pipe grooves capable of generating the capillary force.

9. The loop heat pipe according to claim 8 , wherein the first tabular includes, as the second pipe grooves, a plurality of grooves extending in a width direction of the region to be formed as the second pipe.

10. The loop heat pipe according to claim 8 , wherein the first tabular includes, as the second pipe grooves, a plurality of grooves extending in a length direction of the region to be formed as the second pipe.

11. The loop heat pipe according to claim 1 , wherein the first tabular and the second tabular are respectively metal plates.

12. The loop heat pipe according to claim 1 , wherein the porous structure has structure in which vacancies are exposed to a surface of the structure and communicate with one another.

13. An electronic device comprising:
a heat generating component; and
a loop heat pipe configured to transfer heat of the heat generating component, wherein
the loop heat pipe includes
an evaporator in which a liquid-phase working fluid evaporates;
a condenser in which a vapor-phase working fluid condenses;
a first pipe configured to connect the evaporator and the condenser, the vapor-phase working fluid flowing in the first pipe; and
a second pipe configured to connect the condenser and the evaporator, the liquid-phase working fluid flowing in the second pipe,
the evaporator, the condenser, the first pipe, and the second pipe have structure obtained by joining a first tabular and a second tabular,
the first tabular includes a first recessed section in a region to be formed as the evaporator, a region to be formed as a condensation pipe configuring the condenser, a region to be formed as the first pipe, and a region to be formed as the second pipe and includes, in the region to be formed as the evaporator, grooves capable of generating a capillary force,
the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe, the region to be formed as the first pipe, and the region to be formed as the second pipe, and
a porous structure is provided in the entire second recessed section.

14. A manufacturing method for a loop heat pipe, comprising:
processing a first tabular to form a first recessed section in a region to be formed as an evaporator, a region to be formed as a condensation pipe configuring a condenser, a region to be formed as a first pipe, and a region to be formed as a second pipe and form, in the region to be the evaporator, grooves capable of generating a capillary force;
processing a second tabular to form a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe, the region to be formed as the first pipe, and the region to be formed as the second pipe;
providing a porous structure in the entire second recessed section; and
joining the first tabular and the second tabular.

15. The manufacturing method for the loop heat pipe according to claim 14 , wherein, in the processing the first tabular, the grooves are formed in a region to be formed as a comb teeth-like portion of the evaporator in the first tabular and the first recessed section is formed in a region to be formed as a comb teeth-like vapor channel of the evaporator in the first tabular.

16. The manufacturing method for the loop heat pipe according to claim 14 , wherein, in the processing the first tabular, a column is formed in the first recessed section of the first tabular.

17. The manufacturing method for the loop heat pipe according to claim 14 , wherein, in the processing the first tabular, second pipe grooves capable of generating the capillary force is formed in a region to be formed as the second pipe in the first tabular.

Assignees

• Fujitsu Ltd

Inventors

• Shioga Takeshi
• Abe Tomoyuki

Classifications

• H05K7/20318

  Condensers · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• B23P15/26

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title