Joined body production method, joined body, and hot-melt adhesive sheet

Patent metadata

Field	Value
Publication number	US-12532764-B2
Application number	US-202118008184-A
Country	US
Kind code	B2
Filing date	Jun 3, 2021
Priority date	Jun 5, 2020
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

A joined body production method includes subjecting a first electronic component and a second electronic component to thermocompression bonding via a hot-melt adhesive sheet. The hot-melt adhesive sheet includes a binder and solder particles. The binder includes a crystalline polyamide resin having a carboxyl group. A melting point of the solder particles is 30° C. to 0° C. lower than a temperature of the thermocompression bonding. When melt viscosities of the hot-melt adhesive sheet are measured under a condition of a heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 40° C. lower than the temperature of the thermocompression bonding to a melt viscosity at 20° C. lower than the temperature of the thermocompression bonding of no less than 10.

First claim

The invention claimed is:

1 . A joined body production method comprising:
subjecting a first electronic component comprising a first conductive portion and a second electronic component comprising a second conductive portion to thermocompression bonding via a hot-melt adhesive sheet, to connect the first conductive portion and the second conductive portion, the hot-melt adhesive sheet comprising a binder and solder particles, the binder comprising a crystalline polyamide resin having a carboxyl group, wherein: a melting point of the solder particles is 30° C. to 0° C. lower than a temperature of the thermocompression bonding; and when melt viscosities of the hot-melt adhesive sheet are measured under a condition of a heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 40° C. lower than the temperature of the thermocompression bonding to a melt viscosity at 20° C. lower than the temperature of the thermocompression bonding of no less than 10 and no more than 25.

2 . The joined body production method according to claim 1 , wherein when the melt viscosities of the hot-melt adhesive sheet measured under the condition of the heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 100° C. to a melt viscosity at 120° C. of no less than 10.

3 . The joined body production method according to claim 1 , wherein the binder further comprises a crystalline polyester resin.

4 . The joined body production method according to claim 1 , wherein a proportion of the crystalline polyamide resin in the binder is 50 to 100 wt % relative to a total weight of the binder.

5 . The joined body production method according to claim 1 , wherein the hot-melt adhesive sheet further comprises a flux compound.

6 . The joined body production method according to claim 5 , wherein the flux compound is a carboxylic acid, and
a content of the carboxylic acid is 1 to 10 parts by mass relative to 100 parts by mass of the binder.

7 . The joined body production method according to claim 1 , wherein the solder particles are composed of at least one selected from the group consisting of an Sn—Bi—Cu alloy, an Sn—Bi—Ag alloy, an Sn—Bi alloy, an Sn—Pb—Bi alloy, and an Sn—In alloy.

8 . The joined body production method according to claim 1 , wherein a content of the solder particles in the hot-melt adhesive sheet is 40 to 320 parts by weight relative to 100 parts by weight of the binder.

9 . The joined body production method according to claim 1 , wherein an average particle size of the solder particles is no less than 70% of a thickness of the hot-melt adhesive sheet.

10 . The joined body production method according to claim 1 , wherein at least one of the first conductive portion and the second conductive portion is subjected to a water-soluble pre-flux treatment.

11 . The joined body production method according to claim 1 , wherein the temperature of the thermocompression bonding is 120° C. to 180° C.

12 . The joined body production method according to claim 1 , wherein when the melt viscosities of the hot-melt adhesive sheet measured under the condition of the heating rate of 5° C./min., the hot-melt adhesive sheet has the ratio of the melt viscosity at 40° C. to the melt viscosity at 20° C. of no less than 10 and no more than 18.4.

Assignees

• Dexerials Corp

Inventors

• Kumakura Hiroyuki
• Abe Tomoyuki

Classifications

• H10W70/023

  Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H05K2203/0278

  Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive · CPC title

• H05K3/321

  by conductive adhesives · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C09J2301/408

  additives as essential feature of the adhesive layer · CPC title