Connection body and method for manufacturing connection body

Patent metadata

Field	Value
Publication number	US-2023198186-A1
Application number	US-202117910987-A
Country	US
Kind code	A1
Filing date	Mar 18, 2021
Priority date	Mar 19, 2020
Publication date	Jun 22, 2023
Grant date	—

Abstract

A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.

First claim

1 . A connection body, comprising:
a substrate having a first terminal array; a connector having a second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component.

2 . The connection body according to claim 1 ,
wherein the bottom surface of the connector has a level difference in height within a predetermined range, and wherein the second terminal array has a terminal surface having a maximum height and a minimum height, the difference therebetween being smaller than the height of the predetermined range.

3 . The connection body according to claim 1 , wherein the second terminal array has a terminal surface having a maximum height and a minimum height, the difference therebetween being smaller than the average particle diameter of the solder particles.

4 . The connection body according to claim 1 , wherein the second terminal array extends from the outside to the inside of the bottom surface of the connector.

5 . The connection body according to claim 1 , wherein the average particle diameter of the solder particles is 30 μm or less.

6 . The connection body according to claim 1 , wherein the minimum inter-terminal distance in the second terminal array is 0.8 mm or less.

7 . The connection body according to claim 1 , wherein the connector has no reinforcing portion.

8 . A connector used in the connection body according to claim 1 .

9 . A thermosetting connection material used in the connection body according to claim 1 .

10 . A method for manufacturing a connection body, comprising:
placing, on a substrate having a first terminal array, via a thermosetting connection material containing solder particles and a flux component, a connector having a bottom surface on which a second terminal array is arranged and a level difference canceling portion for canceling a level difference in the bottom surface is formed; and thermally curing the thermosetting connection material at a temperature equal to or higher than the melting point of the solder particles without pressing the connector, thereby connecting the first terminal array and the second terminal array.

11 . The method for manufacturing a connection body according to claim 10 , wherein the thermal curing is performed by reflow.

12 . The method for manufacturing a connection body according to claim 10 , wherein the average particle diameter of the solder particles is 30 μm or less.

13 . The method for manufacturing a connection body according to claim 10 , wherein the minimum inter-terminal distance in the second terminal array is 0.8 mm or less.

14 . A connector, comprising a terminal array disposed on a bottom surface having a level difference of a predetermined height,
wherein the difference between the maximum height and the minimum height of a terminal surface of the terminal array is smaller than the level difference.

15 . The connector according to claim 14 , wherein the terminal array extends from outside to inside the bottom surface of the connector.

Assignees

• Dexerials Corp

Inventors

• Odaka Ryosuke
• Ito Ryo
• Kumakura Hiroyuki
• Abe Tomoyuki
• Sato Daisuke
• Orihara Katsuhisa
• Aoki Kazuhisa

Classifications

• H01R4/04

  using electrically conductive adhesives · CPC title

• H01R43/02

  for soldered or welded connections · CPC title

• H01R13/405 Primary

  Securing in non-demountable manner, e.g. moulding, riveting · CPC title

• H01R12/71

  for rigid printing circuits or like structures · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title