Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board

Patent metadata

Field	Value
Publication number	US-11267225-B2
Application number	US-201616071071-A
Country	US
Kind code	B2
Filing date	Dec 12, 2016
Priority date	Feb 5, 2016
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.

First claim

The invention claimed is:

1. A metal-clad laminated board comprising:
an insulating layer; and
a metal layer in contact with at least one surface of the insulating layer, wherein:
the insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound, the polyphenylene ether having 1.5 to 2 hydroxyl groups on average in one molecule, the epoxy compound having 2 to 2.3 epoxy groups on average in one molecule,
the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less,
the metal layer includes a metal substrate and a barrier layer containing cobalt, the barrier layer being provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer,
the contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz,
the barrier layer does not contain nickel, and
a transmission loss of the metal-clad laminated board is equal to or more than −37 dB/m, where the transmission loss is measured by applying a 15 GHz signal to a straight-line wiring that is formed from the metal layer of the metal-clad laminated board, the straight-line wiring having a length of 1000 mm and a width ranging from 100 μm to 200 μm.

2. The metal-clad laminated board according to claim 1 , wherein the polyphenylene ether is a compound represented by a following formula (1):

wherein, X represents an alkylene group having 1 to 3 carbon atoms or a direct bond, m represents 0 to 20, n represents 0 to 20, and a total of m and n is from 1 to 30.

3. The metal-clad laminated board according to claim 1 , wherein the epoxy compound contains 50% by mass or more of a dicyclopentadiene epoxy compound.

4. The metal-clad laminated board according to claim 1 , wherein the thermosetting resin composition further contains a cyanate ester compound.

5. The metal-clad laminated board according to claim 1 , wherein the thermosetting resin composition further contains a halogen-based flame retardant.

6. The metal-clad laminated board according to claim 5 , wherein the halogen-based flame retardant is a flame retardant to be dispersed without compatibilization in the thermosetting resin composition.

7. The metal-clad laminated board according to claim 5 , wherein the halogen-based flame retardant has a melting point of 300° C. or higher.

8. The metal-clad laminated board according to claim 5 , wherein the halogen-based flame retardant is at least one selected from the group consisting of ethylene dipentabromobenzene, ethylene bistetrabromoimide, decabromodiphenyloxide, tetradecabromodiphenoxybenzene, and bis(tribromophenoxy)ethane.

9. The metal-clad laminated board according to claim 1 , wherein the thermosetting resin composition further contains an organometallic salt.

10. The metal-clad laminated board according to claim 1 , wherein the thermosetting resin composition further contains an inorganic filler.

11. A method for producing a metal-clad laminated board according to claim 1 , the method comprising: preparing a thermosetting resin composition containing a reaction product obtained by reacting at least a part of a polyphenylene ether having 1.5 to 2 hydroxyl groups on average in one molecule with an epoxy group of an epoxy compound having 2 to 2.3 epoxy groups on average in one molecule so that a terminal hydroxyl group concentration is 700 μmol/g or less; preparing a prepreg by impregnating a fibrous substrate with the thermosetting resin composition; and obtaining a metal-clad laminated board including an insulating layer and a metal layer in contact with at least one surface of the insulating layer by laminating the metal layer on the prepreg, followed by heat pressure molding, the insulating layer including a cured product of the thermosetting resin composition, wherein: the metal layer includes a metal substrate and a barrier layer containing cobalt, the barrier layer being provided on the metal substrate at a side adjacent to the metal layer with the insulating layer, and the contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.

12. A method for producing a wiring board, the method comprising obtaining a wiring board by using the metal-clad laminated board according to claim 1 .

13. A resin-attached metal member comprising:
an insulating layer; and
a metal layer in contact with one surface of the insulating layer, wherein:

the insulating layer includes a half-cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound, the polyphenylene ether having 1.5 to 2 hydroxyl groups on average in one molecule, the epoxy compound having 2 to 2.3 epoxy groups on average in one molecule,
the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less,
the metal layer includes a metal substrate and a barrier layer containing cobalt, the barrier layer being provided on the metal substrate at a side adjacent to a contact surface of the metal layer with the insulating layer,
the contact surface has surface roughness of 2μm or less in ten-point average roughness Rz,
the barrier layer does not contain nickel, and
a transmission loss of a metal-clad laminated board obtained by curing the insulating layer is equal to or more than -37 dB/m, where the transmission loss is measured by applying a 15 GHz signal to a straight-line wiring that is formed from the metal layer of the metal-clad laminated board, the straight-line wiring having a length of 1000 mm and a width ranging from 100 μm to 200 μm.

14. A method for producing a resin-attached metal member, the method comprising:
preparing a thermosetting resin composition containing a reaction product obtained by reacting at least a part of a polyphenylene ether having 1.5 to 2 hydroxyl groups on average in one molecule with an epoxy group of an epoxy compound having 2 to 2.3 epoxy groups on average in one molecule so that a terminal hydroxyl group concentration is 700 μmol/g or less; and
obtaining a resin-attached metal member including an insulating layer and a metal layer in contact with one surface of the insulating layer by forming the thermosetting resin composition into a layer form on one surface of the metal layer, the insulating layer including a half-cured product of the thermosetting resin composition, wherein:
the metal layer includes a metal substrate and a barrier layer containing cobalt, the barrier layer being provided on the metal substrate at a side adjacent to a contact surface of the metal layer with the insulating layer,
the contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz,
the barrier layer does not contain nickel, and
a transmission loss of a metal-clad laminated board obtained by curing the insulating layer is equal to or more than -37 dB/m, where the transmission loss is measured by applying a 15 GHz signal to a straight-line wiring that is formed from the metal layer of the metal-clad laminated board, the straight-line wiring having a length of 1000 mm and a width ranging from 100 μm to 200 μm.

15. A method for producing a wiring board, the method comprising obtaining a wiring board by using the resin-attached metal member according to claim 13 .

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Arisawa Tatsuya
• Abe Tomoyuki
• Araki Shunji
• Inoue Yuki

Classifications

• B32B37/182

  one or more of the layers being plastic · CPC title

• B32B5/022 Primary

  Non-woven fabric · CPC title

• B32B2250/40

  Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA · CPC title

• B32B2262/101

  Glass fibres · CPC title

• Y10T428/31511

  Of epoxy ether · CPC title