RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof
US-10637400-B2 · Apr 28, 2020 · US
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Abdo David F patents
Abdo David F is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Abdo David F |
| Total patents | 20 |
| First publication | Apr 30, 2015 |
| Latest publication | Apr 28, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Methods of manufacturing encapsulated semiconductor device package with heatsink opening
US-10630246-B2 · Apr 21, 2020 · US
Rf amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof
US-2019020314-A1 · Jan 17, 2019 · US
Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
US-10109594-B2 · Oct 23, 2018 · US
RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof
US-10075132-B2 · Sep 11, 2018 · US
Pre-plated substrate for die attachment
US-9893027-B2 · Feb 13, 2018 · US
Encapsulated semiconductor device package with heatsink opening
US-2018034421-A1 · Feb 1, 2018 · US
Pre-plated substrate for die attachment
US-2018012855-A1 · Jan 11, 2018 · US
Pre-plated substrate for die attachment
US-2017294393-A1 · Oct 12, 2017 · US
Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof
US-9787254-B2 · Oct 10, 2017 · US
Recent patents
Latest publications not already listed above.
Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof
US-2017085228-A1 · Mar 23, 2017 · US
Rf amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof
US-2016285418-A1 · Sep 29, 2016 · US
Semiconductor device with mechanical lock features between a semiconductor die and a substrate
US-9425161-B2 · Aug 23, 2016 · US
Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
US-2016240488-A1 · Aug 18, 2016 · US
Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
US-9349693-B2 · May 24, 2016 · US
Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
US-2016043039-A1 · Feb 11, 2016 · US
Semiconductor device with mechanical lock features between a semiconductor die and a substrate
US-2015333031-A1 · Nov 19, 2015 · US
Devices and methods of operation for separating semiconductor die from adhesive tape
US-9111984-B2 · Aug 18, 2015 · US
Packaged semiconductor devices and methods of their fabrication
US-9099567-B2 · Aug 4, 2015 · US
Devices and methods of operation for separating semiconductor die from adhesive tape
US-2015114572-A1 · Apr 30, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Freescale Semiconductor Inc | 16 |
| Nxp Usa Inc | 9 |
| Abdo David F | 3 |
| Lakshminarayan Viswanathan | 2 |
| Watts Michael E | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03F3/195 | 12 |
| H03F2200/222 | 12 |
| H03F1/0288 | 12 |
| H10W74/111 | 11 |
| H10W90/736 | 10 |