Semiconductor device
US-10510725-B2 · Dec 17, 2019 · US
of bond wires
of bond wires · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W90/751 |
| Official title | {of bond wires} |
| Display label | of bond wires |
| Total patents | 312 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 11 |
| 2017 | 13 |
| 2018 | 14 |
| 2019 | 17 |
| 2020 | 20 |
| 2021 | 17 |
| 2022 | 22 |
| 2023 | 54 |
| 2024 | 45 |
| 2025 | 68 |
| 2026 | 19 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multichip modules and methods of fabrication
US-10490520-B2 · Nov 26, 2019 · US
Semiconductor module and semiconductor module manufacturing method
US-2019189529-A1 · Jun 20, 2019 · US
Semiconductor packages and methods of forming same
US-2019148276-A1 · May 16, 2019 · US
Package structure of folding magnetic coupling isolator and leadframe component and manufacturing method thereof
US-2019122971-A1 · Apr 25, 2019 · US
Method of manufacturing multi-chip package
US-2019103381-A1 · Apr 4, 2019 · US
Semiconductor device
US-2019088625-A1 · Mar 21, 2019 · US
Multichip modules and methods of fabrication
US-2019088607-A1 · Mar 21, 2019 · US
Plastic-packaged semiconductor device having wires with polymerized insulating layer
US-10199348-B2 · Feb 5, 2019 · US
Measuring device
US-2019035751-A1 · Jan 31, 2019 · US
Multichip modules and methods of fabrication
US-10163833-B2 · Dec 25, 2018 · US
Rectangular semiconductor package and a method of manufacturing the same
US-2018350746-A1 · Dec 6, 2018 · US
Multi-chip package and method of manufacturing the same
US-10147706-B2 · Dec 4, 2018 · US
Semiconductor device
US-10109565-B2 · Oct 23, 2018 · US
Using mems fabrication incorporating into led device mounting and assembly
US-2018301609-A1 · Oct 18, 2018 · US
Power semiconductor module and electric power steering apparatus using the same
US-10096572-B2 · Oct 9, 2018 · US
Semiconductor device
US-2018269132-A1 · Sep 20, 2018 · US
Thermoelectric bonding for integrated circuits
US-2018226322-A1 · Aug 9, 2018 · US
Using MEMS fabrication incorporating into LED device mounting and assembly
US-10026882-B2 · Jul 17, 2018 · US
Compensation of bondwires in the microwave regime
US-10014276-B2 · Jul 3, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W90/751?
- CPC H10W90/751 is the Cooperative Patent Classification code for “of bond wires.”
- How many patents are filed under CPC H10W90/751 (of bond wires)?
- Our database includes 312 publications tagged with this CPC code.
- Is patent activity under CPC H10W90/751 growing?
- Publication counts under this code: 45 in 2024 vs 68 in 2025 (latest complete years).