Compensation of bondwires in the microwave regime

Patent metadata

Field	Value
Publication number	US-10014276-B2
Application number	US-201514631635-A
Country	US
Kind code	B2
Filing date	Feb 25, 2015
Priority date	Feb 25, 2015
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.

First claim

What is claimed is:

1. A method for interfacing an IC to a PCB for a device, according to a desired operating frequency for said device, said method comprising the steps of:
A) fixing said IC to a dielectric substrate;
B) fastening said PCB to said substrate;
C) bonding said IC to said PCB with a wire bond;
D) establishing a ground plane for said PCB; and,
E) defecting said ground plane by forming at least one rectangular opening in said ground plane, when said operating frequency is in the microwave frequency range.

2. A method for extending the operating frequency range of a device, said device having an IC and a PCB interconnected with a groundwire, and said PCB further having a ground plane, wherein said IC has an IC network inductance and said PCB has a PCB network inductance, and said method is accomplished without matching said IC network and PCB network inductances, said method comprising the step of establishing a defect in said ground plane.

3. The method of claim 2 , wherein said operating device in in the microwave region and said geometry is a rectangle.

4. A device, comprising:
a dielectric substrate;
an IC fixed to said substrate;
a PCB fixed to said substrate;
a bondwire connected to said IC and to said PCB;
a ground plane electrically connected to said PCB; and,
said ground plane formed with a defect;
wherein said defect is a rectangular opening when said device is viewed in top plan and when a desired operating frequency for said device is in the microwave region.

Assignees

• Chieh Jia Chi Samuel
• Us Navy

Inventors

• Chieh Jia-Chi Samuel

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/751

  of bond wires · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/534

  being rectangular · CPC title