Power semiconductor module and electric power steering apparatus using the same

Patent metadata

Field	Value
Publication number	US-10096572-B2
Application number	US-201515535463-A
Country	US
Kind code	B2
Filing date	Dec 2, 2015
Priority date	Dec 24, 2014
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.

First claim

The invention claimed is:

1. A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of said power semiconductor bare chip, and that is formed by being contained in a same package, comprises:
wherein said plural power semiconductor elements are basically same outline,
electrodes of said bare chip of said plural power semiconductor elements are mutually connected between said plural power semiconductor elements with a metal connector or a wiring,
said package is a resin mold package that seals said plural power semiconductor elements with an electrical insulating resin,
said power semiconductor elements are same as those of a power semiconductor package inside of a single power semiconductor bare chip and have an external connecting terminal which is not electrically connected by said mutual connection in sealing said resin mold package,
said power semiconductor bare chip is a bare chip of a field effect transistor,
a drain electrode of said bare chip is joined to a metal plate formed to said one external connecting terminal,
a gate electrode and a source electrode of said bare chip are provided with a spaced side from said one external connecting terminal against said drain electrode, and
portions of said gate electrode and said source electrode are mutually connected between said power semiconductor elements with said metal connector or said wiring,
said metal plate has an exposed portion which is exposed from said package inside to an exterior, and said exposed portion is connectable to a heat dissipater which is disposed on an exterior.

2. The power semiconductor module according to claim 1 , wherein said two power semiconductor elements are arranged in parallel, a source electrode of a bare chip of a first power semiconductor element is electrically connected to a source electrode of a bare chip of a second power semiconductor element with two metal connectors, and said first and second power semiconductor elements are functionally integrated.

3. The power semiconductor module according to claim 2 , wherein said one external connecting terminal and said other external connecting terminals are mutually arranged in parallel.

4. The power semiconductor module according to claim 2 , wherein said arrangements are arranged in parallel to said power semiconductor elements on a flat surface.

5. The power semiconductor module according to claim 2 , wherein said arrangements are arranged in parallel to said power semiconductor elements along a virtual curved surface.

6. The power semiconductor module according to claim 5 , wherein said virtual curved surface is a side surface of a cylinder, and said external connecting terminals are parallel to a direction of a main axis of said cylinder.

7. An electric power steering apparatus that uses the power semiconductor module according to claim 2 , comprises:
said one power semiconductor module, one module comprising said two power semiconductor elements to control a power supply in said electric power steering apparatus, and said two power semiconductor elements being contained in a same package,
wherein said four power semiconductor modules are formed in a curved shape along a side surface shape of a control unit of said electric power steering apparatus or said three-phase brushless motor, and are disposed on a side surface of a control unit of said electric power steering apparatus or said three-phase brushless motor.

8. The power semiconductor module according to claim 1 , wherein said three power semiconductor elements are arranged in parallel, a source electrode of a bare chip of a first power semiconductor element is electrically connected to a drain electrode of a bare chip of a second power semiconductor element through a metal plate portion of said second power semiconductor element with two metal connectors, said metal plate portion of said second power semiconductor element is electrically connected to a source electrode of a bare chip of a third power semiconductor element with other two metal connectors, and said first, second, and third power semiconductor elements are functionally integrated.

9. The power semiconductor module according to claim 8 , wherein said one external connecting terminal and said other external connecting terminals are mutually arranged in parallel.

10. The power semiconductor module according to claim 8 , wherein said arrangements are arranged in parallel to said power semiconductor elements on a flat surface.

11. The power semiconductor module according to claim 8 , wherein said arrangements are arranged in parallel to said power semiconductor elements along a virtual curved surface.

12. The power semiconductor module according to Claim 11 , wherein said virtual curved surface is a side surface of a cylinder, and said external connecting terminals are parallel to a direction of a main axis of said cylinder.

13. An electric power steering apparatus that uses the power semiconductor module according to Claim 8 , comprises:
said three power semiconductor modules, each module comprising said three power semiconductor elements to control each one phase in a three-phase brushless motor which is used in said electric power steering apparatus, and three elements being contained in a same package.

14. The power semiconductor module according to claim 1 , wherein said one external connecting terminal and said other external connecting terminals are mutually arranged in parallel.

15. The power semiconductor module according to claim 1 , wherein said arrangements are arranged in parallel to said power semiconductor elements on a flat surface.

16. The power semiconductor module according to claim 1 , wherein said arrangements are arranged in parallel to said power semiconductor elements along a virtual curved surface.

17. The power semiconductor module according to claim 16 , wherein said virtual curved surface is a side surface of a cylinder, and said external connecting terminals are parallel to a direction of a main axis of said cylinder.

18. The power semiconductor module according to claim 1 , wherein a material of said metal plate is copper or aluminum.

19. An electric power steering apparatus that uses the power semiconductor module according to claim 1 .

20. A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of said power semiconductor bare chip, and that is formed by being contained in a same package, comprises:
wherein said plural power semiconductor elements are basically same outline,
electrodes of said bare chip of said plural power semiconductor elements are mutually connected between said plural power semiconductor elements with a metal connector or a wiring,
said package is a resin mold package that seals said plural power semiconductor elements with an electrical insulating resin,
said power semiconductor elements are same as those of a power semiconductor package inside of a single power semiconductor bare chip and have

Assignees

• Nsk Ltd

Inventors

• Shimakawa Shigeru
• Sunaga Takashi
• Sekine Takaaki

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/751

  of bond wires · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title