Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
by heating, e.g. melting or causing diffusion
by heating, e.g. melting or causing diffusion · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W80/035 |
| Official title | {by heating, e.g. melting or causing diffusion} |
| Display label | by heating, e.g. melting or causing diffusion |
| Total patents | 105 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 7 |
| 2017 | 10 |
| 2018 | 15 |
| 2019 | 14 |
| 2020 | 8 |
| 2021 | 12 |
| 2022 | 3 |
| 2023 | 11 |
| 2024 | 7 |
| 2025 | 8 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Chemical mechanical polishing for hybrid bonding
US-10840205-B2 · Nov 17, 2020 · US
Manufacturing method of semiconductor device
US-2020357771-A1 · Nov 12, 2020 · US
Member for solid-state image pickup device and method for manufacturing solid-state image pickup device
US-2020243584-A1 · Jul 30, 2020 · US
Semiconductor device with multiple substrates electrically connected through an insulating film
US-10707258-B2 · Jul 7, 2020 · US
Member for solid-state image pickup device and method for manufacturing solid-state image pickup device
US-10651231-B2 · May 12, 2020 · US
Semiconductor device and manufacturing method
US-2019386056-A1 · Dec 19, 2019 · US
Dbi to si bonding for simplified handle wafer
US-2019326252-A1 · Oct 24, 2019 · US
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
US-10431621-B2 · Oct 1, 2019 · US
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
US-2019273109-A1 · Sep 5, 2019 · US
Increased contact alignment tolerance for direct bonding
US-2019244899-A1 · Aug 8, 2019 · US
Conductive barrier direct hybrid bonding
US-2019237419-A1 · Aug 1, 2019 · US
Increased contact alignment tolerance for direct bonding
US-10269708-B2 · Apr 23, 2019 · US
Room temperature metal direct bonding
US-2019115247-A1 · Apr 18, 2019 · US
Member for solid-state image pickup device and method for manufacturing solid-state image pickup device
US-10263034-B2 · Apr 16, 2019 · US
Conductive barrier direct hybrid bonding
US-10262963-B2 · Apr 16, 2019 · US
Semiconductor apparatus and method for preparing the same
US-2019109113-A1 · Apr 11, 2019 · US
Member for solid-state image pickup device and method for manufacturing solid-state image pickup device
US-2019096931-A1 · Mar 28, 2019 · US
Chemical mechanical polishing for hybrid bonding
US-2019096842-A1 · Mar 28, 2019 · US
Conductive pad structure for hybrid bonding and methods of forming same
US-10177106-B2 · Jan 8, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W80/035?
- CPC H10W80/035 is the Cooperative Patent Classification code for “by heating, e.g. melting or causing diffusion.”
- How many patents are filed under CPC H10W80/035 (by heating, e.g. melting or causing diffusion)?
- Our database includes 105 publications tagged with this CPC code.
- Is patent activity under CPC H10W80/035 growing?
- Publication counts under this code: 7 in 2024 vs 8 in 2025 (latest complete years).