Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
by chemical means, e.g. etching
by chemical means, e.g. etching · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W80/033 |
| Official title | {by chemical means, e.g. etching} |
| Display label | by chemical means, e.g. etching |
| Total patents | 175 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 1 |
| 2018 | 5 |
| 2019 | 10 |
| 2020 | 19 |
| 2021 | 25 |
| 2022 | 24 |
| 2023 | 24 |
| 2024 | 24 |
| 2025 | 36 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Graphite thin film/silicon substrate laminated assembly, process for producing the same, and substrate for enhanced heat discharge type electronic devices
US-2021407883-A1 · Dec 30, 2021 · US
Selective recess of interconnects for probing hybrid bond devices
US-11189585-B2 · Nov 30, 2021 · US
Wafer Bonding Method
US-2021305200-A1 · Sep 30, 2021 · US
Reliable hybrid bonded apparatus
US-2021305202-A1 · Sep 30, 2021 · US
Bonding surfaces for microelectronics
US-2021287910-A1 · Sep 16, 2021 · US
Structures for bonding elements
US-2021265227-A1 · Aug 26, 2021 · US
Die processing
US-2021233888-A1 · Jul 29, 2021 · US
Dbi to si bonding for simplified handle wafer
US-2021233889-A1 · Jul 29, 2021 · US
Metal-dielectric bonding method and structure
US-2021210459-A1 · Jul 8, 2021 · US
Bonding surfaces for microelectronics
US-11056348-B2 · Jul 6, 2021 · US
Selective recess of interconnects for probing hybrid bond devices
US-2021175192-A1 · Jun 10, 2021 · US
Method of manufacturing semiconductor device and semiconductor device
US-2021151406-A1 · May 20, 2021 · US
Semiconductor device packages and methods of manufacturing the same
US-11011491-B2 · May 18, 2021 · US
Multi-deck three-dimensional memory devices and methods for forming the same
US-10985142-B2 · Apr 20, 2021 · US
Die processing
US-10985133-B2 · Apr 20, 2021 · US
Manufacturing method of semiconductor device
US-10978428-B2 · Apr 13, 2021 · US
Methods & structures for improved electrical contact between bonded integrated circuit interfaces
US-2021098359-A1 · Apr 1, 2021 · US
DBI to Si bonding for simplified handle wafer
US-10964664-B2 · Mar 30, 2021 · US
Semiconductor device packages and methods of manufacturing the same
US-2021074669-A1 · Mar 11, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W80/033?
- CPC H10W80/033 is the Cooperative Patent Classification code for “by chemical means, e.g. etching.”
- How many patents are filed under CPC H10W80/033 (by chemical means, e.g. etching)?
- Our database includes 175 publications tagged with this CPC code.
- Is patent activity under CPC H10W80/033 growing?
- Publication counts under this code: 24 in 2024 vs 36 in 2025 (latest complete years).