Wafer-level package including under bump metal layer
US-11862589-B2 · Jan 2, 2024 · US
Bond pads having a filler embedded in a matrix
Bond pads having a filler embedded in a matrix · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/925 |
| Official title | {Bond pads having a filler embedded in a matrix} |
| Display label | Bond pads having a filler embedded in a matrix |
| Total patents | 411 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 21 |
| 2016 | 23 |
| 2017 | 35 |
| 2018 | 34 |
| 2019 | 36 |
| 2020 | 47 |
| 2021 | 52 |
| 2022 | 45 |
| 2023 | 43 |
| 2024 | 38 |
| 2025 | 29 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic component, electronic apparatus, and method of manufacturing electronic apparatus
US-9853014-B2 · Dec 26, 2017 · US
Semiconductor device fabricated by flux-free soldering
US-2017365544-A1 · Dec 21, 2017 · US
Integrated circuit assembly
US-9842807-B2 · Dec 12, 2017 · US
Light emitting device
US-2017323873-A1 · Nov 9, 2017 · US
Integrated circuit package using polymer-solder ball structures and forming methods
US-2017271285-A1 · Sep 21, 2017 · US
Chip package and method for forming the same
US-2017256496-A1 · Sep 7, 2017 · US
Connection body
US-2017236795-A1 · Aug 17, 2017 · US
Chip package and method for forming the same
US-2017207182-A1 · Jul 20, 2017 · US
Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
US-9673096-B2 · Jun 6, 2017 · US
Multi-chip structure and method of forming same
US-9653433-B2 · May 16, 2017 · US
Method of manufacturing an electronic device having a contact pad with partially sealed pores
US-9620466-B1 · Apr 11, 2017 · US
Electronic component, electronic apparatus, and method of manufacturing electronic apparatus
US-2017098631-A1 · Apr 6, 2017 · US
Substrate with embedded sintered heat spreader and process for making the same
US-9589864-B2 · Mar 7, 2017 · US
Interconnections for a substrate associated with a backside reveal
US-2017040268-A1 · Feb 9, 2017 · US
Chip scale sensing chip package and a manufacturing method thereof
US-2017025370-A1 · Jan 26, 2017 · US
Electronic devices with attached die structures and methods of formation of such devices
US-2016365323-A1 · Dec 15, 2016 · US
Connection body
US-2016351531-A1 · Dec 1, 2016 · US
Electrical connector between die pad and z-interconnect for stacked die assemblies
US-9508689-B2 · Nov 29, 2016 · US
Process for connecting joining parts
US-9502376-B2 · Nov 22, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/925?
- CPC H10W72/925 is the Cooperative Patent Classification code for “Bond pads having a filler embedded in a matrix.”
- How many patents are filed under CPC H10W72/925 (Bond pads having a filler embedded in a matrix)?
- Our database includes 411 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/925 growing?
- Publication counts under this code: 38 in 2024 vs 29 in 2025 (latest complete years).