Method for producing a semiconductor assembly comprising a semiconductor element and a substrate, and corresponding device
US-2025391803-A1 · Dec 25, 2025 · US
using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/07537 |
| Official title | {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} |
| Display label | using a polymer adhesive, e.g. an adhesive based on silicone or epoxy |
| Total patents | 44 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 4 |
| 2017 | 5 |
| 2018 | 5 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 8 |
| 2022 | 3 |
| 2023 | 4 |
| 2024 | 2 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multiple integrated circuit chip/module embedding by underfilling and direct print additive manufacturing
US-2025336879-A1 · Oct 30, 2025 · US
Semiconductor device
US-2025105177-A1 · Mar 27, 2025 · US
Selective soldering with photonic soldering technology
US-12041728-B2 · Jul 16, 2024 · US
Packaged transistor with channeled die attach materials and process of implementing the same
US-2024079320-A1 · Mar 7, 2024 · US
Semiconductor package including semiconductor chips
US-11791303-B2 · Oct 17, 2023 · US
UV fixing glue for assembly
US-11778753-B2 · Oct 3, 2023 · US
Semiconductor package including semiconductor chips
US-2023154886-A1 · May 18, 2023 · US
Semiconductor package including semiconductor chips
US-11569193-B2 · Jan 31, 2023 · US
Packaged electronic device with split die pad in robust package substrate
US-11444012-B2 · Sep 13, 2022 · US
Integrated circuit having die attach materials with channels and process of implementing the same
US-11424177-B2 · Aug 23, 2022 · US
Semiconductor package including semiconductor chips
US-2022130793-A1 · Apr 28, 2022 · US
Integrated Circuit Having Die Attach Materials with Channels and Process of Implementing the Same
US-2021351113-A1 · Nov 11, 2021 · US
Abstracted NAND logic in stacks
US-11139283-B2 · Oct 5, 2021 · US
Packaged electronic device with split die pad in robust package substrate
US-2021305139-A1 · Sep 30, 2021 · US
Selective Soldering with Photonic Soldering Technology
US-2021185831-A1 · Jun 17, 2021 · US
Method for fabricating an electronic device
US-2021125957-A1 · Apr 29, 2021 · US
Anisotropic conductive film
US-10964440-B2 · Mar 30, 2021 · US
Uv fixing glue for assembly
US-2021068263-A1 · Mar 4, 2021 · US
Selective Soldering with Photonic Soldering Technology
US-2021043597-A1 · Feb 11, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/07537?
- CPC H10W72/07537 is the Cooperative Patent Classification code for “using a polymer adhesive, e.g. an adhesive based on silicone or epoxy.”
- How many patents are filed under CPC H10W72/07537 (using a polymer adhesive, e.g. an adhesive based on silicone or epoxy)?
- Our database includes 44 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/07537 growing?
- Publication counts under this code: 2 in 2024 vs 3 in 2025 (latest complete years).