Anisotropic conductive film

Patent metadata

Field	Value
Publication number	US-10964440-B2
Application number	US-201716071858-A
Country	US
Kind code	B2
Filing date	Feb 10, 2017
Priority date	Feb 22, 2016
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component.

First claim

The invention claimed is:

1. An anisotropic conductive film comprising:
a binder composition containing a film forming component and a cationically polymerizable component;
a cationic polymerization initiator; and
conductive particles, wherein
the cationic polymerization initiator is a quaternary ammonium salt-based thermal acid generator, wherein the quaternary ammonium salt-based thermal acid generator is a salt of quaternary ammonium cation and hexafluoroantimonate anion,
the cationically polymerizable component contains an alicyclic epoxy compound and a low polarity oxetane compound, wherein the alicyclic epoxy compound is diglycidyl hexahydrobisphenol A or diepoxybicyclohexyl and the low polarity oxetane compound is 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane or 4,4′-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl, and
the conductive particles are present in the anisotropic film in a range of from 50 to 100000 per square millimeter, millimeter
a reaction start temperature of a reaction peak is from 60 to 80° C., and
a reaction end temperature measured of the reaction peak is from 155 to 185° C., the reaction peak being measured by a differential scanning calorimetry.

2. The anisotropic conductive film according to claim 1 , wherein a compounded proportion of the alicyclic epoxy compound and the low polarity oxetane compound is from 25:75 to 60:40 on a mass basis.

3. The anisotropic conductive film according to claim 1 , wherein a compounded proportion of the alicyclic epoxy compound and the low polarity oxetane compound is from 45:55 to 60:40 on a mass basis.

4. The anisotropic conductive film according to claim 1 , wherein the quaternary ammonium cation is a cation represented by [NR 1 R 2 R 3 R 4 ] + , where R 1 , R 2 , R 3 , and R 4 are a straight-chain, branched-chain or cyclic alkyl group or aryl group having from 1 to 12 carbons.

5. A connection structure comprising:
the anisotropic conductive film described in claim 1 ;
a first electronic component; and
a second electronic component, wherein
the first electronic component and the second electronic component are anisotropically conductively connected via the anisotropic conductive film.

Assignees

• Dexerials Corp

Inventors

• Hayashi Shinichi
• Tokuhisa Kenji
• Yamaguchi Etsuko

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07537

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/354

  comprising polymers · CPC title