High voltage power module
US-9839146-B2 · Dec 5, 2017 · US
Adaptable interconnections, e.g. fuses or antifuses
Adaptable interconnections, e.g. fuses or antifuses · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/641 |
| Official title | {Adaptable interconnections, e.g. fuses or antifuses} |
| Display label | Adaptable interconnections, e.g. fuses or antifuses |
| Total patents | 324 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 22 |
| 2016 | 23 |
| 2017 | 25 |
| 2018 | 27 |
| 2019 | 26 |
| 2020 | 30 |
| 2021 | 15 |
| 2022 | 43 |
| 2023 | 17 |
| 2024 | 50 |
| 2025 | 35 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multi-layer integrated circuits having isolation cells for layer testing and related methods
US-2017343603-A1 · Nov 30, 2017 · US
Semiconductor device and method of testing semiconductor device
US-9823291-B2 · Nov 21, 2017 · US
SMD, IPD, and/or wire mount in a package
US-9754928-B2 · Sep 5, 2017 · US
Methods for making multi-die package with bridge layer
US-2017236724-A1 · Aug 17, 2017 · US
Large-scale reconfigurable electronics using low-cost nanoparticle ink printing method
US-2017223838-A1 · Aug 3, 2017 · US
Assigning nets to wiring planes using zero wire load and signal propagation timing for chip design
US-2017212976-A1 · Jul 27, 2017 · US
Reconfigurable repeater system
US-9679854-B2 · Jun 13, 2017 · US
Semiconductor device and manufacturing method thereof
US-2017117200-A1 · Apr 27, 2017 · US
High voltage power module
US-2017112005-A1 · Apr 20, 2017 · US
Nanoelectromechanical antifuse and related systems
US-9628086-B2 · Apr 18, 2017 · US
Board, board apparatus and method for interconnection of boards
US-9619000-B2 · Apr 11, 2017 · US
Method and circuits for communication in multi-die packages
US-9607948-B2 · Mar 28, 2017 · US
Flexible device including sliding interconnection structure
US-2017064832-A1 · Mar 2, 2017 · US
Semiconductor package having a substrate structure with selective surface finishes
US-2017040273-A1 · Feb 9, 2017 · US
Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits
US-9508615-B2 · Nov 29, 2016 · US
Interposers for integrated circuits with one-time programming and methods for manufacturing the same
US-2016343719-A1 · Nov 24, 2016 · US
Electrically reconfigurable interposer with built-in resistive memory
US-9502469-B2 · Nov 22, 2016 · US
Method and circuits for communication in multi-die packages
US-2016293548-A1 · Oct 6, 2016 · US
Board, board apparatus and method for interconnection of boards
US-2016282923-A1 · Sep 29, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/641?
- CPC H10W70/641 is the Cooperative Patent Classification code for “Adaptable interconnections, e.g. fuses or antifuses.”
- How many patents are filed under CPC H10W70/641 (Adaptable interconnections, e.g. fuses or antifuses)?
- Our database includes 324 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/641 growing?
- Publication counts under this code: 50 in 2024 vs 35 in 2025 (latest complete years).