Power module and electrical device
US-2024235414-A1 · Jul 11, 2024 · US
of side rails, e.g. having holes
of side rails, e.g. having holes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/438 |
| Official title | {of side rails, e.g. having holes} |
| Display label | of side rails, e.g. having holes |
| Total patents | 346 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 16 |
| 2017 | 19 |
| 2018 | 19 |
| 2019 | 25 |
| 2020 | 20 |
| 2021 | 32 |
| 2022 | 40 |
| 2023 | 40 |
| 2024 | 52 |
| 2025 | 63 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
US-10115660-B2 · Oct 30, 2018 · US
Selective planishing method for making a semiconductor device
US-2018204739-A1 · Jul 19, 2018 · US
Modified leadframe design with adhesive overflow recesses
US-2018190576-A1 · Jul 5, 2018 · US
Multi-stacked electronic device with defect-free solder connection
US-2018153035-A1 · May 31, 2018 · US
Electronic device, manufacturing method and lead frame for same
US-2018151482-A1 · May 31, 2018 · US
Selective planishing method for making a semiconductor device
US-9972506-B2 · May 15, 2018 · US
Multi-stacked electronic device with defect-free solder connection
US-9936576-B2 · Apr 3, 2018 · US
Multi-stacked electronic device with defect-free solder connection
US-9913375-B2 · Mar 6, 2018 · US
Strip-type substrate for producing chip card modules
US-2018039875-A1 · Feb 8, 2018 · US
Semiconductor package with clip alignment notch
US-9870985-B1 · Jan 16, 2018 · US
Semiconductor package with clip alignment notch
US-2018012829-A1 · Jan 11, 2018 · US
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
US-2017358523-A1 · Dec 14, 2017 · US
Chip-on-film package and display device including the same
US-2017358520-A1 · Dec 14, 2017 · US
Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
US-2017345743-A1 · Nov 30, 2017 · US
Semiconductor package with wettable flank
US-2017338170-A1 · Nov 23, 2017 · US
Lead frame system
US-2017309546-A1 · Oct 26, 2017 · US
Leadframe
US-9793194-B2 · Oct 17, 2017 · US
Lead frame, package, and light-emitting device, and methods for manufacturing the same
US-2017288103-A1 · Oct 5, 2017 · US
Method for producing optoelectronic semiconductor components, leadframe assembly and optoelectronic semiconductor component
US-9741616-B2 · Aug 22, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/438?
- CPC H10W70/438 is the Cooperative Patent Classification code for “of side rails, e.g. having holes.”
- How many patents are filed under CPC H10W70/438 (of side rails, e.g. having holes)?
- Our database includes 346 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/438 growing?
- Publication counts under this code: 52 in 2024 vs 63 in 2025 (latest complete years).