Semiconductor package with clip alignment notch

Patent metadata

Field	Value
Publication number	US-2018012829-A1
Application number	US-201615207462-A
Country	US
Kind code	A1
Filing date	Jul 11, 2016
Priority date	Jul 11, 2016
Publication date	Jan 11, 2018
Grant date	—

Abstract

An electronic component includes a leadframe and a first semiconductor die. The leadframe includes a leadframe top side, a leadframe bottom side opposite the leadframe top side, and a top notch at the leadframe top side. The top notch includes a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch, and can also include a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base. The first semiconductor die can include a die top side a die bottom side opposite the die top side and mounted onto the leadframe top side, and a die perimeter. The top notch can be located outside the die perimeter. Other examples and related methods are also disclosed herein.

First claim

1 . An electronic component comprising:
a leadframe top plane; a leadframe bottom plane parallel to the leadframe top plane; a leadframe comprising:
a leadframe top side comprising:
a leadframe top end, along which the leadframe top plane extends;

a leadframe bottom side comprising:
a leadframe bottom end, along which the leadframe bottom plane extends; and

a top notch comprising:
a top notch base located between the leadframe top plane and the leadframe bottom plane, and defining a notch length of the top notch; and
a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;

a first semiconductor die comprising:
a die top side;
a die bottom side mounted on the leadframe top side; and
die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
wherein the top notch is located outside the die perimeter; a clip comprising:
a clip tail having a clip edge inserted into the top notch such that a bottom of the clip edge is beneath the leadframe top side; and
a clip roof coupled to the clip tail;
wherein:
the clip roof is attached to the first semiconductor die;
the clip tail protrudes from the top notch past the leadframe top side;
the bottom of the clip edge adjoins the top notch first sidewall at an angle; and
a depth of the top notch base relative to the leadframe top side prevents the bottom of the clip edge from direct contact with the top notch base.

2 . The electronic component of claim 1 , further comprising:
a fusing structure extending between the bottom of the clip edge and the top notch base, wherein the fusing structure fuses the clip edge in the top notch.

3 . The electronic component of claim 1 , wherein:
the top notch base and the top notch first sidewall comprise respective portions of the leadframe top side; and the bottom of the clip edge is completely beneath the leadframe top side.

4 . The electronic component of claim 2 , wherein:
the top notch comprises:
a notch second sidewall opposite, across the top notch base, to the notch first sidewall;
the notch second sidewall is closer to the first semiconductor die than the top notch first sidewall; and the fusing structure extends to physically contact the notch second sidewall.

5 . An electronic component comprising:
a leadframe comprising:
a leadframe top side;
a leadframe bottom side opposite the leadframe top side; and
a top notch at the leadframe top side and comprising:
a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch;
and
a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;

a first semiconductor die comprising:
a die top side;
a die bottom side opposite the die top side and mounted onto the leadframe top side; and
die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
wherein the top notch is located outside the die perimeter; and a clip comprising:
a clip tail having a clip edge inserted into the top notch such that a bottom of the clip edge is beneath the leadframe top side;
wherein:
the clip tail protrudes from the top notch past the leadframe top side;
the bottom of the clip edge adjoins the top notch first sidewall at an angle; and
a depth of the top notch base relative to the leadframe top side prevents the bottom of the clip edge from direct contact with the top notch base.

6 . The electronic component of claim 5 , wherein the top notch base is discontinuous.

7 . The electronic component of claim 5 , wherein:
the clip edge directly contacts the top notch first sidewall along a corner of the clip edge.

8 . The electronic component of claim 5 , wherein:
the clip edge is fused to the notch by a solder material that extends between the bottom of the clip edge and the top notch base.

9 . The electronic component of claim 5 , wherein:
the clip comprises a clip roof coupled to the clip tail; and a clip roof bottom of the clip roof is coupled to the die top side.

10 . The electronic component of claim 9 , wherein:
the die top side comprises:
a gate terminal coupled to the leadframe top side at a lead of the leadframe; and
one of a source terminal or a drain terminal coupled to the clip roof bottom through a fusing structure.

11 . The electronic component of claim 5 , further comprising:
a second semiconductor die located over the first semiconductor die; wherein:
the clip comprises a clip roof coupled to the clip tail; and
a clip roof bottom of the clip roof is coupled to a top side of the second semiconductor die.

12 . The electronic component of claim 5 , wherein:
the top notch base and the top notch first sidewall are defined by respective etched surfaces.

13 . The electronic component of claim 5 , wherein:
the top notch base and the top notch first sidewall are continuous throughout the notch length.

14 . The electronic component of claim 5 , wherein:
the die bottom side comprises:
a gate terminal coupled to the leadframe top side at a first lead of the leadframe; and
one of a source terminal or a drain terminal coupled through a fusing structure to at least one of a second lead or a paddle of the leadframe.

15 . The electronic component of claim 5 , wherein:
the top notch comprises:
a notch second sidewall extended, along the notch length, from the leadframe top side to the top notch base;
wherein the notch second sidewall is closer to the first semiconductor die than the top notch first sidewall.

16 . The electronic component of claim 5 , wherein:
the leadframe comprises a lead having a bottom notch at the leadframe bottom side, the bottom notch comprising:
a bottom notch base located between the leadframe top side and the leadframe bottom side; and
a bottom notch sidewall extended, adjacent the bottom notch base, from the leadframe bottom side to the bottom notch base;
wherein a depth of bottom notch is greater than a depth of the top notch.

17 . An electronic component comprising:
a leadframe comprising:
a leadframe top side;
a leadframe bottom side opposite the leadframe top side; and
a top notch at the leadframe top side and comprising:
a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch;
and
a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base;

and a first semiconductor die comprising:
a die top side;
a die bottom side opposite the die top side and mounted onto the leadframe top side; and
die sidewalls, located between the die top side and the die bottom side, and defining a die perimeter;
wherein:
the top notch is located outside the die perimeter; and
the leadframe comprises a lead having:
a first lead leg having a first leg inner end defining a first section of the top notch first sidewall; and
a second lead leg having a second leg inner end defining a second section of the top notch first sidewall.

18 . The electronic component of claim 17 , wherein:
the top notch first sidewall is discontinuous between the first leg inner end and the second leg inner end.

19 . The electronic component of claim 18 , wherein:
the top notch base is discontinuous between the first leg inner end and the second leg inner end.

20 . A

Assignees

• Amkor Technology Inc

Inventors

• Mangrum Marc Alan

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title