Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns

Patent metadata

Field	Value
Publication number	US-10115660-B2
Application number	US-201715688227-A
Country	US
Kind code	B2
Filing date	Aug 28, 2017
Priority date	Jan 22, 2016
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

First claim

What is claimed is:

1. A leadframe strip comprising:
a first leadframe column and a second leadframe column, each of the first leadframe column and the second leadframe column including a plurality of leadframes, each of the plurality of leadframes including a die attach pad of a plurality of die attach pads, the plurality of die attach pads including a first die attach pad of the first leadframe column and a second die attach pad of the second leadframe column; and
a plurality of leads associated with each of the plurality of die attach pads, the plurality of leads associated with the first die attach pad and the second die attach pad connected to a first dam bar associated with the first die attach pad and a second dam bar associated with the second die attach pad, the first and second dam bars connected together using a portion of the leadframe strip, the portion aligned in a first direction;
wherein the first die attach pad and the second die attach pad are offset from each other in a second direction, the second direction being at an angle with respect to the first direction.

2. The leadframe strip of claim 1 , wherein a third die attach pad of a third leadframe column adjacent to the second leadframe column and the first die attach pad are aligned in the second direction.

3. The leadframe strip of claim 1 , wherein the plurality of leads of the first die attach pad and the second die attach pad are offset from each other in the second direction.

4. The leadframe strip of claim 1 , wherein the leadframe strip is free of mold runners.

5. The leadframe strip of claim 1 , wherein each die attach pad of the plurality of die attach pads includes dam bars located adjacent to opposite first and second sides of the die attach pad.

6. The leadframe strip of claim 5 , wherein the plurality of leads connect the dam bars, that are adjacent to each other in the second direction, of the two die attach pads that are offset from each other in the second direction.

7. A leadframe strip comprising:
a plurality of connected leadframes arranged in a plurality of leadframe columns; and
a plurality of die attach pads, each of the plurality of connected leadframes associated with one of the plurality of die attached pads, wherein the plurality of die attach pads in two adjacent columns are offset from each other.

8. The leadframe strip of claim 7 , wherein the plurality of die attach pads are offset from each other in a first direction.

9. The leadframe strip of claim 8 , wherein the plurality of die attach pads are offset from each other in a second direction, the second direction being at an angle with respect to the first direction.

10. The leadframe strip of claim 9 , wherein each of the plurality of leadframe columns is oriented in the second direction.

11. The leadframe strip of claim 7 further comprising first and second dam bars located adjacent to opposite first and second sides of each die attach pad of the plurality of die attach pads.

12. The leadframe strip of claim 11 , wherein the first and second dam bars are connected to each other using plurality of lead structures.

13. The leadframe strip of claim 12 , wherein the plurality of lead structures are continuous lead structures.

Assignees

• Texas Instruments Inc

Inventors

• Lee Lee Han Meng@Eugene
• Bin Abdul Aziz Anis Fauzi
• Lim Wei Fen Sueann

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/014

  using batch processing · CPC title