Electronic component package and method of manufacturing the same
US-9842789-B2 · Dec 12, 2017 · US
shielding resins
shielding resins · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W42/284 |
| Official title | {shielding resins} |
| Display label | shielding resins |
| Total patents | 308 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 22 |
| 2017 | 50 |
| 2018 | 40 |
| 2019 | 54 |
| 2020 | 40 |
| 2021 | 26 |
| 2022 | 18 |
| 2023 | 14 |
| 2024 | 14 |
| 2025 | 12 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic component package and method of manufacturing the same
US-2017330814-A1 · Nov 16, 2017 · US
Composite magnetic sealing material
US-9818518-B2 · Nov 14, 2017 · US
Microelectronics package with inductive element and magnetically enhanced mold compound component
US-2017323804-A1 · Nov 9, 2017 · US
Electronic circuit package
US-2017311448-A1 · Oct 26, 2017 · US
Substrate for camera module and camera module having the same
US-2017294469-A1 · Oct 12, 2017 · US
Packages for integrated circuits and methods of packaging integrated circuits
US-9786838-B2 · Oct 10, 2017 · US
Systems and methods for electromagnetic interference shielding
US-2017287846-A1 · Oct 5, 2017 · US
Semiconductor package having an emi shielding layer
US-2017287851-A1 · Oct 5, 2017 · US
Semiconductor package
US-2017287852-A1 · Oct 5, 2017 · US
Semiconductor package
US-9780047-B1 · Oct 3, 2017 · US
Fan-out semiconductor package
US-2017278766-A1 · Sep 28, 2017 · US
Semiconductor package and manufacturing method therefor
US-9768154-B2 · Sep 19, 2017 · US
Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer
US-9761538-B1 · Sep 12, 2017 · US
Manufacturing a package using plateable encapsulant
US-2017256472-A1 · Sep 7, 2017 · US
Conductive coating material for shielding electronic component package and method for producing shielded package
US-2017247550-A1 · Aug 31, 2017 · US
Systems and Methods for Microelectronics Fabrication and Packaging Using a Magnetic Polymer
US-2017250133-A1 · Aug 31, 2017 · US
Method for fabricating package structure
US-2017103953-A1 · Apr 13, 2017 · US
Circuit module and method for manufacturing the same
US-2017098637-A1 · Apr 6, 2017 · US
Semiconductor package and manufacturing method therefor
US-2017092633-A1 · Mar 30, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W42/284?
- CPC H10W42/284 is the Cooperative Patent Classification code for “shielding resins.”
- How many patents are filed under CPC H10W42/284 (shielding resins)?
- Our database includes 308 publications tagged with this CPC code.
- Is patent activity under CPC H10W42/284 growing?
- Publication counts under this code: 14 in 2024 vs 12 in 2025 (latest complete years).