Substrate for camera module and camera module having the same

Patent metadata

Field	Value
Publication number	US-2017294469-A1
Application number	US-201615370604-A
Country	US
Kind code	A1
Filing date	Dec 6, 2016
Priority date	Apr 11, 2016
Publication date	Oct 12, 2017
Grant date	—

Abstract

A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.

First claim

What is claimed is:

1 . A substrate for a camera module, the substrate comprising:
a first substrate; an image sensor installed on the first substrate so as to be disposed below a lens; and a memory chip embedded in the first substrate, wherein the first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.

2 . The substrate for a camera module of claim 1 , wherein the hard substrate portion disposed on the upper portion of the soft substrate portion includes a via for a connection with the memory chip, and
the memory chip includes a connection pad exposed to a top surface of the memory chip to be connected to the via.

3 . The substrate for a camera module of claim 1 , wherein a mounting groove connecting the hard substrate portion disposed on the lower portion of the soft substrate portion to the hard substrate portion disposed on the upper portion of the soft substrate portion, through the soft substrate portion, is formed in the first substrate.

4 . The substrate for a camera module of claim 3 , wherein a resin layer is formed in a space formed by the installation hole and the memory chip.

5 . The substrate for a camera module of claim 1 , wherein a reinforcement plate is installed on a bottom surface of the first substrate.

6 . A substrate for a camera module, the substrate comprising:
a first substrate; and an image sensor package including an image sensor and a memory chip connected to the image sensor, and installed on the first substrate.

7 . The substrate for a camera module of claim 6 , wherein the image sensor package includes:
a frame in which a through-hole is formed; a rewiring portion stacked on the frame; the image sensor installed on a top surface of the rewiring part; the memory chip disposed in the through-hole and installed on a bottom surface of the rewiring part; an encapsulant filled in a space formed by the memory chip and the through-hole; and an electrode pad exposed to a bottom surface of the encapsulant and connected to the rewiring portion through a connection via.

8 . The substrate for a camera module of claim 7 , wherein a solder ball is formed on the electrode pad.

9 . The substrate for a camera module of claim 6 , wherein the first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion.

10 . The substrate for a camera module of claim 9 , wherein the image sensor package is disposed in an installation groove formed in the first substrate, in order to be installed in the first substrate.

11 . The substrate for a camera module of claim 10 , wherein a reinforcement member mounting groove disposed below the installation groove is formed in the first substrate, and
a reinforcement plate is installed in the reinforcement member mounting groove.

12 . The substrate for a camera module of claim 6 , further comprising a reinforcement plate installed below the first substrate.

13 . The substrate for a camera module of claim 12 , wherein the image sensor package is installed on a top surface of the first substrate.

14 . A substrate for a camera module, the substrate comprising:
a first substrate; an image sensor installed on the first substrate; a memory chip inserted into a recessed groove formed to be depressed from a bottom surface of the first substrate; and a molding layer filled in a space formed by the depressed groove and the memory chip.

15 . The substrate for a camera module of claim 14 , wherein the first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and
the depressed groove is formed from the hard substrate portion disposed on the lower portion of the soft substrate portion to the soft substrate portion.

16 . The substrate for a camera module of claim 14 , wherein the depressed groove is formed to be stepped, and
the image sensor and the memory chip are connected to the first substrate by a wire-bonding.

17 . A camera module comprising:
a lens barrel in which at least one lens is installed; and the substrate for a camera module of claim 1 on which the lens barrel is installed and in which an image sensor is disposed below the lens.

Assignees

• Samsung Electro Mech

Inventors

• Lee Seung Eun
• Park Jin Seon
• Chung Yul Kyo
• Choi Chul
• Jung Dae Young
• Kook Seung Yeop

Classifications

• H10W42/284

  shielding resins · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title