Implementing resistance defect performance mitigation using test signature directed self heating and increased voltage
US-2016379898-A1 · Dec 29, 2016 · US
comprising connection or disconnection of parts of a device in response to a measurement
comprising connection or disconnection of parts of a device in response to a measurement · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P74/232 |
| Official title | {comprising connection or disconnection of parts of a device in response to a measurement} |
| Display label | comprising connection or disconnection of parts of a device in response to a measurement |
| Total patents | 761 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 44 |
| 2016 | 45 |
| 2017 | 59 |
| 2018 | 67 |
| 2019 | 94 |
| 2020 | 101 |
| 2021 | 87 |
| 2022 | 67 |
| 2023 | 59 |
| 2024 | 66 |
| 2025 | 58 |
| 2026 | 14 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Light emitting device and manufacturing method thereof
US-9490184-B2 · Nov 8, 2016 · US
Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
US-9484323-B2 · Nov 1, 2016 · US
Aggregation of semiconductor devices and the method thereof
US-2016300822-A1 · Oct 13, 2016 · US
Fault tolerant design for large area nitride semiconductor devices
US-2016284829-A1 · Sep 29, 2016 · US
Semiconductor apparatus having TSV and testing method thereof
US-9455190-B2 · Sep 27, 2016 · US
Bypass capacitor circuit and method of providing a bypass capacitance for an integrated circuit die
US-9431338-B2 · Aug 30, 2016 · US
Yield enhancing vertical redundancy method for 3D wafer level packaged (WLP) integrated circuit systems
US-9425110-B1 · Aug 23, 2016 · US
Methods, apparatus, and systems for secure demand paging and other paging operations for processor devices
US-2016232105-A1 · Aug 11, 2016 · US
Apparatus and methods for through substrate via test
US-2016233136-A1 · Aug 11, 2016 · US
Solid state lighting devices with reduced crystal lattice dislocations and associated methods of manufacturing
US-2016225948-A1 · Aug 4, 2016 · US
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
US-9330988-B1 · May 3, 2016 · US
Device and method for alignment of vertically stacked wafers and die
US-2016079131-A1 · Mar 17, 2016 · US
Self-repair logic for stacked memory architecture
US-2016055922-A1 · Feb 25, 2016 · US
Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same
US-2016049382-A1 · Feb 18, 2016 · US
Semiconductor device and method of testing semiconductor device
US-2016043029-A1 · Feb 11, 2016 · US
Integrated circuit having main route and detour route for signal transmission and integrated circuit package including the same
US-2015371926-A1 · Dec 24, 2015 · US
Reclaimable semiconductor device package and associated systems and methods
US-2015364214-A1 · Dec 17, 2015 · US
Method of self-correcting power grid for semiconductor structures
US-9214427-B2 · Dec 15, 2015 · US
Semiconductor apparatus having tsv and testing method thereof
US-2015348857-A1 · Dec 3, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P74/232?
- CPC H10P74/232 is the Cooperative Patent Classification code for “comprising connection or disconnection of parts of a device in response to a measurement.”
- How many patents are filed under CPC H10P74/232 (comprising connection or disconnection of parts of a device in response to a measurement)?
- Our database includes 761 publications tagged with this CPC code.
- Is patent activity under CPC H10P74/232 growing?
- Publication counts under this code: 66 in 2024 vs 58 in 2025 (latest complete years).