Substrate processing apparatus, substrate processing system, and maintenance method
US-2024339306-A1 · Oct 10, 2024 · US
the wafers being placed on a susceptor, stage or support
the wafers being placed on a susceptor, stage or support · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/7604 |
| Official title | {the wafers being placed on a susceptor, stage or support} |
| Display label | the wafers being placed on a susceptor, stage or support |
| Total patents | 865 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 21 |
| 2016 | 34 |
| 2017 | 56 |
| 2018 | 69 |
| 2019 | 80 |
| 2020 | 98 |
| 2021 | 94 |
| 2022 | 101 |
| 2023 | 108 |
| 2024 | 100 |
| 2025 | 91 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor package
US-2017207108-A1 · Jul 20, 2017 · US
Cleaning device and roll cleaning member
US-2017170034-A1 · Jun 15, 2017 · US
Laser processing apparatus
US-2017087663-A1 · Mar 30, 2017 · US
Adjustable process spacing, centering, and improved gas conductance
US-2017018413-A1 · Jan 19, 2017 · US
Method and apparatus for depositing a silicon-containing film
US-2016379868-A1 · Dec 29, 2016 · US
Methods including a processing of wafers and spin coating tool
US-2016379900-A1 · Dec 29, 2016 · US
Self-Centering Wafer Carrier System For Chemical Vapor Deposition
US-2016372321-A1 · Dec 22, 2016 · US
Method and arrangement for handling and processing substrates
US-2016370704-A1 · Dec 22, 2016 · US
Substrate processing apparatus, method for manufacturing semiconductor device and computer-readable recording medium
US-9523150-B2 · Dec 20, 2016 · US
Substrate transfer apparatus, substrate transfer method, and non-transitory storage medium
US-9507349-B2 · Nov 29, 2016 · US
Substrate holder assembly for controlled layer transfer
US-9502278-B2 · Nov 22, 2016 · US
Substrate pedestal module including backside gas delivery tube and method of making
US-2016333475-A1 · Nov 17, 2016 · US
Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon wafer
US-2016300753-A1 · Oct 13, 2016 · US
Adjustable process spacing, centering, and improved gas conductance
US-9464349-B2 · Oct 11, 2016 · US
Method of clamping a substrate and clamp preparation unit using capillary clamping force
US-9460954-B2 · Oct 4, 2016 · US
Substrate holding method and substrate processing apparatus
US-2016284585-A1 · Sep 29, 2016 · US
Die bonding device
US-9455165-B2 · Sep 27, 2016 · US
Substrate processing method, and substrate processing device
US-2016247698-A1 · Aug 25, 2016 · US
Substrate processing apparatus, substrate processing method, and storage medium
US-2016240370-A1 · Aug 18, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/7604?
- CPC H10P72/7604 is the Cooperative Patent Classification code for “the wafers being placed on a susceptor, stage or support.”
- How many patents are filed under CPC H10P72/7604 (the wafers being placed on a susceptor, stage or support)?
- Our database includes 865 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/7604 growing?
- Publication counts under this code: 100 in 2024 vs 91 in 2025 (latest complete years).