Substrate holder assembly for controlled layer transfer

Patent metadata

Field	Value
Publication number	US-9502278-B2
Application number	US-201313867441-A
Country	US
Kind code	B2
Filing date	Apr 22, 2013
Priority date	Apr 22, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.

First claim

What is claimed as new is:

1. A method for removing a material layer from a base substrate, said method comprising:
confining a base substrate having vertical edges within a substrate holder assembly, said substrate holder assembly comprises:
a base structure having a surface in which said base substrate can be placed thereupon, a framing element located above and spaced apart from the surface of the base structure by a thickness of the base substrate, said framing element having a window which exposes an upper surface of the base substrate, and a support structure containing at least one mechanical securing element and located on the framing element, wherein the at least one mechanical securing element is mechanically coupled to at least one surface of the support structure;

forming a stressor layer atop the exposed surface of the base substrate; and
removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer, wherein said support structure and said framing element are removed after forming the stressor layer and prior to spalling.

2. The method of claim 1 , further comprising forming an edge exclusion material on a surface of the base substrate and at each vertical edge of the base substrate prior to said confining the base substrate to said substrate holder assembly.

3. The method of claim 2 , wherein after confining said base substrate to said substrate holder assembly said edge exclusion material is located directly beneath a surface of the framing element.

4. The method of claim 1 , wherein said substrate holder assembly further comprises a compliant material located between the base structure and the base substrate.

5. The method of claim 4 , wherein said compliant layer comprises an elastomer having a Young's modulus less than a Young's modulus of the support structure.

6. The method of claim 1 , further comprising forming a handle substrate on the exposed surface of the stressor layer.

7. The method of claim 6 , wherein said spalling is performed at room temperature.

8. The method of claim 7 , wherein said spalling comprises pulling or peeling the handle substrate.

9. The method of claim 1 , further comprising removing at least said stressor layer from said material layer.

10. The method of claim 1 , wherein said support structure is a vacuum chuck containing a plurality of vacuum through holes or an electrostatic chuck.

11. The method of claim 1 , wherein said framing element comprises a stainless steel sheet or a conductive elastomer.

12. The method of claim 11 , wherein said conductive elastomer is anisotropically conductive.

13. A method for removing a material layer from a base substrate, said method comprising:
confining a base substrate having vertical edges within a substrate holder assembly, said substrate holder assembly comprises:
a base structure having a surface in which said base substrate can be placed thereupon, a framing element located above and spaced apart from the surface of the base structure by a thickness of the base substrate, said framing element having a window which exposes an upper surface of the base substrate, and a support structure containing at least one mechanical securing element and located on the framing element, wherein the at least one mechanical securing element is mechanically coupled to at least one surface of the support structure;

forming a stressor layer atop the exposed surface of the base substrate; and
removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer, and wherein said support structure, said framing element, and said base structure are removed after spalling.

14. The method of claim 1 , wherein said at least one mechanical securing element comprises a screw, a clamp, a magnetic, or a pressure based securing element.

15. A method for removing a material layer from a base substrate, said method comprising:
confining a base substrate having vertical edges within a substrate holder assembly, said substrate holder assembly comprises:
a base structure having a surface in which said base substrate can be placed thereupon, a framing element located above and spaced apart from the surface of the base structure by a thickness of the base substrate, said framing element having a window which exposes an upper surface of the base substrate, and a support structure containing at least one mechanical securing element and located on the framing element, wherein the at least one mechanical securing element is mechanically coupled to at least one surface of the support structure, wherein a compliant material is located between the base structure and the base substrate;

forming a stressor layer atop the exposed surface of the base substrate; and
removing a material layer of said base substrate by spalling, wherein said material layer is attached to at least said stressor layer.

Assignees

• IBM

Inventors

• Bedell Stephen W
• Fogel Keith E
• Lauro Paul A
• Sadana Devendra K

Classifications

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title