Die bonding device

Patent metadata

Field	Value
Publication number	US-9455165-B2
Application number	US-201514660093-A
Country	US
Kind code	B2
Filing date	Mar 17, 2015
Priority date	Apr 16, 2014
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

First claim

What is claimed is:

1. A die bonding device comprising:
a wafer holder supporting a wafer on which a die is formed;
an ejector holder disposed at an inner portion of the wafer holder and below the wafer and supporting a die ejector in a vertical orientation, the die ejector configured to help separate the die from the wafer;
a support unit supporting a substrate on which the separated die is to be attached;
a bonding unit configured to pick up the separated die from the wafer and attach the picked-up die to the substrate;
an ejector buffer unit configured to receive the die ejector, wherein the ejector buffer unit is horizontally spaced apart from the wafer holder, and wherein the ejector buffer unit comprises a plate shaped ejector buffer member including at least one fixing member configured to receive the die ejector and hold the die ejector in the vertical orientation at the ejector buffer member; and
a replacing unit configured to transfer the die ejector between the ejector holder and the ejector buffer unit.

2. The device of claim 1 , wherein the fixing member protrudes from a top of the ejector buffer member and includes an electromagnet.

3. The device of claim 1 , wherein the fixing member is provided as a recess formed at a top of the ejector buffer member.

4. The device of claim 1 , wherein the fixing member comprises a plurality of fixing hooks each comprising a latch member configured to be received in a recess of the die ejector so as to fix the die ejector at the ejector buffer unit.

5. The device of claim 1 , wherein the ejector buffer unit further comprises a check member disposed adjacent to the ejector buffer member and configured to check a type of the die ejector disposed at the fixing member or to check whether the fixing member is empty.

6. The device of claim 1 , wherein the replacing unit is configured to:
remove the die ejector from the ejector holder, transfer the die ejector away from the ejector holder and toward the ejector buffer unit with the die ejector in the vertical orientation, and place the die ejector on the at least one fixing member in the vertical orientation; and
remove the die ejector from the at least one fixing member, transfer the die ejector away from the ejector buffer unit and toward the ejector holder with the die ejector in the vertical orientation, and place the die ejector on the ejector holder in the vertical orientation, and wherein the replacing unit comprises:
a movable replacing body;
at least one finger configured to pick up the die ejector; and
an arm movably connecting the finger to the replacing body.

7. The device of claim 1 , wherein the replacing unit is configured to:
remove the die ejector from the ejector holder, transfer the die ejector away from the ejector holder and toward the ejector buffer unit with the die ejector in the vertical orientation, and place the die ejector on the at least one fixing member in the vertical orientation; and
remove the die ejector from the at least one fixing member, transfer the die ejector away from the ejector buffer unit and toward the ejector holder with the die ejector in the vertical orientation, and place the die ejector on the ejector holder in the vertical orientation, and wherein the replacing unit comprises:
a movable replacing body;
a pickup channel configured to receive the die ejector formed in the replacing body; and
an electromagnet in the replacing body adjacent to the pickup channel.

8. A die bonding device comprising:
a wafer holder supporting a wafer on which a die is formed;
an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector in a vertical orientation, the die ejector configured to help separate the die from the wafer;
a support unit supporting a substrate on which the separated die is to be attached;
a bonding unit configured to pick up the separated die from the wafer and attach the picked-up die to the substrate, the bonding unit comprising a bonding member holding a collet at a bottom portion thereof such that the picked-up die contacts the collet;
an ejector buffer unit configured to receive the die ejector, wherein the ejector buffer unit is horizontally spaced apart from the wafer holder, and wherein the ejector buffer unit comprises a plate shaped ejector buffer member including a plurality of fixing members each configured to receive the die ejector and hold the die ejector in the vertical orientation at the ejector buffer member; and
a replacing unit configured to transfer the die ejector between the ejector holder and the ejector buffer unit with the die ejector in the vertical orientation,
wherein the replacing unit comprises:
a movable replacing body; and
a pickup member configured to pick up the die ejector and configured to fix the die ejector at the replacing body, and

wherein the replacing body is configured to move in a vertical direction to adjust a vertical position of the pickup member and configured to move in a horizontal direction to move the pickup member in the vertical position on a horizontal plane.

9. The device of claim 8 , wherein the die bonding device further comprises a collet buffer member comprising a collet receiving recess configured to receive the collet from the bonding unit.

10. The device of claim 9 , wherein the receiving recess comprises a first receiving portion and a second receiving portion that intersects the first receiving portion, each sized and configured to receive differently sized collets.

11. The device of claim 9 , wherein a test unit is disposed on the collet buffer member, the test unit configured to measure a horizontal degree of the collet that is held by the bonding unit.

12. The device of claim 9 , wherein the collet buffer member comprises a plurality of receiving recesses, and wherein a jig having a shape corresponding to the collet and having a hardness greater than the collet is disposed at one of the receiving recesses.

13. The device of claim 9 , wherein the collet buffer member comprises a magnet disposed adjacent to the receiving recess.

14. The device of claim 8 , wherein the bonding member is movable and comprises an electromagnet disposed at a bottom portion thereof configured to detach the collet from the bonding member.

15. The device of claim 8 , wherein the bonding member is movable and comprises fixing hooks rotatably coupled to the bonding member and configured to apply pressure on an outer surface of the collet to fix the collet to the bonding member.

16. A die bonding device comprising:
a wafer holder supporting a wafer comprising a die;
an ejector holder holding a die ejector in a vertical orientation below the die, the die ejector configured to separate the die from the wafer;
a support unit supporting a substrate;
a bonding unit configured to pick up the separated die from the wafer and attach the picked-up die to the substrate;
an ejector buffer unit configured to receive the die ejector, wherein the ejector buffer unit is horizontally spaced apart from the wafer holder, and wherein the ejector buffer unit comprises a plate shaped ejector buffer member including a plurality of fixing members each configured to receive the die ejector and hold the die ejector in the vertical orientation at the ejector buffer member; and
a replacing unit configured to:
remove the die ejector from the ejector holder, transfer the die ejector away from the ejector holder and toward the ejector buffer unit with the die ejector in the vertical orientation, and place the die ejector on one of the plurality of fixing members in the vertica

Assignees

• Samsung Electronics Co Ltd

Inventors

• Hwang Yisung
• Lee Sugil
• Kim Dongjun
• Ha Yongdae

Classifications

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/32

  between different workstations · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H01L21/67703

  Electricity · mapped topic