Adjustable process spacing, centering, and improved gas conductance

Patent metadata

Field	Value
Publication number	US-9464349-B2
Application number	US-201414187585-A
Country	US
Kind code	B2
Filing date	Feb 24, 2014
Priority date	Jan 29, 2010
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

Embodiments of the invention generally provide a process kit for use in a physical deposition chamber (PVD) chamber. In one embodiment, the process kit provides adjustable process spacing, centering between the cover ring and the shield, and controlled gas flow between the cover ring and the shield contributing to uniform gas distribution, which promotes greater process uniformity and repeatability along with longer chamber component service life.

First claim

The invention claimed is:

1. A shield for encircling a sputtering target, comprising:
a base plate;
a cylindrical outer band having a first diameter, the cylindrical outer band vertically extending a first distance from the base plate to a top end;
a cylindrical inner band having a second diameter less than the first diameter, the cylindrical inner band vertically extending from the base plate a second distance less than the first distance; and
at least one centering mechanism disposed on an inner periphery of the cylindrical inner band and extending radially inward and perpendicular to the cylindrical inner band, wherein the centering mechanism comprises a ball disposed on the inner periphery of the cylindrical inner band.

2. The shield of claim 1 , wherein the cylindrical outer band and the cylindrical inner band are substantially perpendicular to the base plate.

3. The shield of claim 1 , wherein the first distance is between about 5 inches and about 7 inches.

4. The shield of claim 1 , wherein the second distance is between about 1.5 inches to about 4 inches.

5. The shield of claim 1 , wherein the first diameter is between about 16 inches and about 18 inches.

6. The shield of claim 1 , wherein the second diameter is between about 14 inches and about 16 inches.

7. The shield of claim 1 , wherein the base plate, cylindrical outer band, and cylindrical inner band comprise a unitary structure.

8. The shield of claim 7 , wherein the unitary structure is made from aluminum or stainless steel.

9. The shield of claim 1 , wherein six centering mechanisms are evenly distributed around the second diameter.

10. The shield of claim 9 , wherein each of the centering mechanisms are positioned a uniform distance from a top of the cylindrical inner band.

11. The shield of claim 1 , wherein a sloped step extends from a top portion of the cylindrical outer band radially beyond the first diameter.

12. The shield of claim 11 , wherein a mounting flange extends radially outward from the sloped step.

13. A shield for a physical vapor deposition chamber, comprising:
a cylindrical outer band;
a cylindrical inner band;
a base plate coupling the cylindrical inner and outer bands for forming a single piece unitary member; and
a plurality of balls coupled to an inner periphery of the cylindrical inner band, wherein each ball of the plurality of balls is disposed within a centering mechanism, with each centering mechanism extending radially inward and perpendicular to the cylindrical inner band.

14. The shield of claim 13 , wherein the balls comprise a sapphire material.

15. The shield of claim 14 , further comprising:
a plurality of cylindrical holders, each holder having a respective one of the balls inserted therein, the cylindrical holders disposed in holes formed in the cylindrical inner band.

16. The shield of claim 15 , wherein the holes are evenly spaced around the cylindrical inner band.

17. The shield of claim 16 , wherein the holes are positioned a uniform distance from a top of the cylindrical inner band.

18. The shield of claim 13 , wherein an upper portion of the cylindrical outer band is sized to surround a sputtering target and a bottom portion of the cylindrical outer band is sized to surround a substrate support.

19. The shield of claim 13 , wherein the cylindrical outer band and the cylindrical inner band are substantially perpendicular to the base plate.

Assignees

• Applied Materials Inc

Inventors

• Hawrylchak Lara
• Savandaiah Kirankumar

Classifications

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• C23C14/564 Primary

  Means for minimising impurities in the coating chamber such as dust, moisture, residual gases · CPC title

• H01J37/32477

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

• Y10T428/12528

  Semiconductor component · CPC title