Substrate holding method and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-2016284585-A1
Application number	US-201615080627-A
Country	US
Kind code	A1
Filing date	Mar 25, 2016
Priority date	Mar 27, 2015
Publication date	Sep 29, 2016
Grant date	—

Abstract

A substrate holding method is to horizontally hold a substrate, and includes a positioning step of positioning a substrate by moving a substrate transfer mechanism and by allowing the peripheral edge of the substrate to come into contact with the plurality of positioning pins, a substrate grasping step of bringing the plurality of grasping pins into a closed state after completing the positioning step so that the substrate held by the plurality of positioning pins and the plurality of grasping pins, and a transfer mechanism receding step of allowing the substrate transfer mechanism to recede from above the spin base after completing the substrate grasping step.

First claim

1 . A substrate holding method for horizontally holding a substrate, the substrate holding method comprising,
a placing step of placing a substrate on a substrate transfer mechanism; a first preparation step of bringing a plurality of positioning pins disposed along a circumferential direction into a closed state in a first area of a peripheral edge of an upper surface of a spin base; a second preparation step of bringing a plurality of grasping pins disposed along the circumferential direction into an open state in a second area that does not coincide with the first area in the circumferential direction in the peripheral edge of the upper surface of the spin base; a positioning step of positioning the substrate by moving the substrate transfer mechanism after completing the placing step, the first preparation step, and the second preparation step and by allowing the peripheral edge of the substrate to come into contact with the plurality of positioning pins; a substrate grasping step of bringing the plurality of grasping pins into a closed state after completing the positioning step so that the substrate held by the plurality of positioning pins and the plurality of grasping pins; and a transfer mechanism receding step of allowing the substrate transfer mechanism to recede from above the spin base after completing the substrate grasping step.

2 . The substrate holding method according to claim 1 , wherein the plurality of positioning pins are disposed in the first area within a distribution angle of 180 degrees.

3 . The substrate holding method according to claim 1 , wherein the plurality of positioning pins are always kept in a closed state during the second preparation step, the positioning step, the substrate grasping step, and the transfer mechanism receding step.

4 . A substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising a substrate holding/rotating device that horizontally holding and rotating a substrate and a substrate transfer mechanism that transfers the substrate,
the substrate holding/rotating device comprising: a spin base that is rotatable on a rotational axis; a rotation driving mechanism that rotates the spin base; a plurality of positioning pins disposed along a circumferential direction in a first area of a peripheral edge of an upper surface of the spin base; a plurality of grasping pins disposed along the circumferential direction in a second area that does not coincide with the first area in the circumferential direction of the peripheral edge of the upper surface of the spin base; a grasping pin opening/closing mechanism that allows the plurality of grasping pins to perform switching between a closed state and an open state; and a control unit that controls an operation of the substrate transfer mechanism, an operation of the rotation driving mechanism, and an operation of the grasping pin opening/closing mechanism.

5 . The substrate processing apparatus according to claim 4 , wherein the plurality of positioning pins are disposed in the first area within a distribution angle of 180 degrees.

6 . The substrate processing apparatus according to claim 4 , wherein the plurality of positioning pins are always kept in a closed state.

Assignees

• Screen Holdings Co Ltd

Inventors

• Kobayashi Kazutaka
• Kato Hiroshi

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/3302 Primary

  Mechanical parts of transfer devices · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title