Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge
US-12588463-B2 · Mar 24, 2026 · US
characterised by a material, a roughness, a coating or the like
characterised by a material, a roughness, a coating or the like · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/135 |
| Official title | {characterised by a material, a roughness, a coating or the like} |
| Display label | characterised by a material, a roughness, a coating or the like |
| Total patents | 42 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 3 |
| 2017 | 2 |
| 2018 | 9 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 5 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 6 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Graphite disc
US-12494392-B2 · Dec 9, 2025 · US
Wafer boat
US-12412763-B2 · Sep 9, 2025 · US
Fluidic assembly MicroLED mass transfer method
US-12132034-B2 · Oct 29, 2024 · US
Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge
US-2024355655-A1 · Oct 24, 2024 · US
Fluidic assembly carrier substrate for microLED mass transfer
US-11990453-B2 · May 21, 2024 · US
Fluidic Assembly MicroLED Mass Transfer Method
US-2024145443-A1 · May 2, 2024 · US
Fluidic assembly enabled mass transfer for microLED displays
US-11894350-B2 · Feb 6, 2024 · US
Wafer boat and plate for wafer boat
US-2024038560-A1 · Feb 1, 2024 · US
Substrate supports, semiconductor processing systems, and material layer deposition methods
US-2023386874-A1 · Nov 30, 2023 · US
Substrate support, test device, and method of adjusting temperature of substrate support
US-11810800-B2 · Nov 7, 2023 · US
Fluidic Assembly Carrier Substrate for MicroLED Mass Transfer
US-2023253377-A1 · Aug 10, 2023 · US
Graphite disc
US-2023253225-A1 · Aug 10, 2023 · US
Wafer boat
US-2023111655-A1 · Apr 13, 2023 · US
Transport fixing jig
US-11420832-B2 · Aug 23, 2022 · US
Manufacturing method of ESD protection device
US-11328946-B2 · May 10, 2022 · US
Substrate processing method and substrate processing apparatus
US-11322365-B2 · May 3, 2022 · US
Substrate support, test device, and method of adjusting temperature of substrate support
US-2021296145-A1 · Sep 23, 2021 · US
Manufacturing method of esd protection device
US-2021282253-A1 · Sep 9, 2021 · US
ESD protection composite structure, ESD protection device, and manufacturing method thereof
US-11044798-B2 · Jun 22, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/135?
- CPC H10P72/135 is the Cooperative Patent Classification code for “characterised by a material, a roughness, a coating or the like.”
- How many patents are filed under CPC H10P72/135 (characterised by a material, a roughness, a coating or the like)?
- Our database includes 42 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/135 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).