Fluidic assembly enabled mass transfer for microLED displays

Patent metadata

Field	Value
Publication number	US-11894350-B2
Application number	US-202017101016-A
Country	US
Kind code	B2
Filing date	Nov 23, 2020
Priority date	Oct 31, 2014
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

First claim

We claim:

1. A micro-light emitting diode (microLED) mass transfer stamping system comprising:
a stamp substrate with a top surface;
an array of stamp substrate trap sites formed on the top surface, each trap site configured as a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED; and
wherein the microLEDs are surface mount microLEDs, each having a planar top surface with a first electrode and a second electrode, and wherein the keel is electrically nonconductive.

2. The stamping system of claim 1 wherein the array of stamp substrate trap sites have a pitch separating adjacent trap sites;
the stamping system further comprising:
a fluidic assembly carrier substrate comprising:
a planar top surface; and,
an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites.

3. The stamping system of claim 2 wherein the carrier substrate wells have a first perimeter shape and a planar well bottom surface; and,
the stamping system further comprising:
a plurality of surface mount microLEDs, each having the first perimeter shape, and a planar top surface interfacing a corresponding well bottom surface, with a first electrode and a second electrode.

4. The stamping system of claim 2 further comprising:
a first fluidic assembly carrier substrate with an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites;
a second fluidic assembly carrier substrate with an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites;
a third fluidic assembly carrier substrate with an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites;
a plurality of microLEDs configured to emit light in a first wavelength, each occupying a corresponding well in the first carrier substrate;
a plurality of microLEDs configured to emit light in a second wavelength, each occupying a corresponding well in the second carrier substrate; and,
a plurality of microLEDs configured to emit light in a third wavelength, each occupying a corresponding well in the third carrier substrate.

5. The stamping system of claim 2 further comprising:
a force generator underlying the carrier substrate wells selected from the group consisting of electrostatic and magnetic force generators.

6. The stamping system of claim 1 wherein the stamp substrate top surface is patterned with a substance selected from the group consisting of an adhesive or an elastomer.

7. The stamping system of claim 1 further comprising:
a force generator underlying the stamp substrate trap sites selected from the group consisting of electrostatic and magnetic force generators.

8. A micro-light emitting diode (microLED) mass transfer stamping system comprising:
a fluidic assembly stamp substrate with a planar top surface;
an array of trap sites formed in the stamp substrate top surface with a first perimeter shape, a depth, and a planar trap site bottom surface;
a plurality of microLEDs, each occupying a corresponding trap site and having the first perimeter shape, a thickness greater than the trap site depth, a planar bottom surface interfaced to the trap site bottom surface, a planar top surface extending out of the trap site with a first electrode, and a securing mechanism; and
wherein the securing mechanism is a keel formed on the microLED top surface, selected from the group consisting of an electrically conductive keel connected to the first electrode and a temporary keel that is electrically non-conductive.

9. The stamping system of claim 8 wherein the stamp substrate trap site bottom surface is coated with a first component of a conjugated bio molecule pair; and,
wherein the securing mechanism is a second component of the conjugated bio molecule pair coating each microLED bottom surface.

10. The stamping system of claim 9 wherein the conjugated bio molecules are selected from the group consisting of biotin-streptavidin, thiol-maleimide, and azide-alkyne.

11. The stamping system of claim 8 wherein the microLEDs have an electrical interface selected from the group consisting of a vertical microLED with a second electrode formed on the bottom surface and a surface mount microLED with first and second electrodes formed on the top surface.

12. A micro-light emitting diode (microLED) mass transfer stamping system comprising:
a fluidic assembly stamp substrate with a planar top surface;
an array of trap sites formed in the stamp substrate top surface having a first perimeter shape, a center section with a planar first depth, a distal end with a planar second depth less than the first depth, and a proximal end with the planar second depth;
a plurality of axial microLEDs, each occupying a corresponding trap site and having the first perimeter shape, a body interfaced with the trap site center section having a vertical plane body thickness greater than the trap site first depth, but less than 2× the trap site first depth, a distal electrode horizontally bisecting the body and interfaced with the trap site distal end, having a vertical plane electrode thickness greater than the trap site second depth, but less than 2× the trap site second depth, and a proximal electrode horizontally bisecting the body and interfaced with the trap site proximal end, having the electrode thickness.

13. A micro-light emitting diode (microLED) mass transfer stamping system comprising:
a stamp substrate with a top surface;
an array of stamp substrate trap sites formed on the top surface having a pitch separating adjacent trap sites, each trap site configured as a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED;
a first fluidic assembly carrier substrate comprising:
a planar top surface;
an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites.

a second fluidic assembly carrier substrate comprising:
a planar top surface;
an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites;

a third fluidic assembly carrier substrate comprising;
a planar top surface; and,
an array of wells formed in the carrier substrate top surface having a pitch separating adjacent wells matching the pitch separating the stamp substrate trap sites;

a plurality of microLEDs configured to emit light in a first wavelength, each occupying a corresponding well in the first carrier substrate;
a plurality of microLEDs configured to emit light in a second wavelength, each occupying a corresponding well in the second carrier substrate; and,
a plurality of microLEDs configured to emit light in a third wavelength, each occupying a corresponding well in the third carrier substrate.

14. A micro-light emitting diode (microLED) mass transfer stamping system comprising:
a fluidic assembly stamp substrate with a planar top surface;
an array of trap sites formed in the stamp substrate top surface with a first perimeter shape, a depth, and a planar trap site bottom surface coated with a first component of a conjugated bio molecule pair; and,
a plurality of microLEDs, each occupying a corresponding trap site and having the firs

Assignees

• Elux Inc
• E Lux Inc

Inventors

• Schuele Paul J
• Sasaki Kenji
• Ulmer Kurt
• Lee Jong-Jan

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0198

  batch processes · CPC title