Transport fixing jig

US11420832B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11420832-B2
Application numberUS-201716084628-A
CountryUS
Kind codeB2
Filing dateMar 14, 2017
Priority dateMar 18, 2016
Publication dateAug 23, 2022
Grant dateAug 23, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.

First claim

Opening claim text (preview).

The invention claimed is: 1. A transport fixing jig, comprising: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8. 2. The transport fixing jig according to claim 1 , further comprising a second base material, wherein the carbon nanotube aggregate is formed on the second base material, and wherein the first base material and the second base material are bonded to each other via the adhesive layer. 3. The transport fixing jig according to claim 1 , wherein an adhesive forming the adhesive layer comprises an inorganic adhesive or a carbon-based adhesive. 4. The transport fixing jig according to claim 3 , wherein the inorganic adhesive comprises a ceramic adhesive. 5. The transport fixing jig according to claim 1 , wherein when the transport fixing jig is left to stand under 450° C. for 1 hour, a change in modulus of elasticity of the adhesive layer is 50% or less. 6. The transport fixing jig according to claim 1 , wherein the adhesive layer has a linear expansion coefficient of from 5 ppm/° C. to 12 ppm/° C. 7. The transport fixing jig according to claim 1 , wherein a material forming the first base material comprises alumina. 8. The transport fixing jig according to claim 1 , wherein a surface of the carbon nanotube aggregate has a coefficient of static friction against a glass surface at 23° C. of from 1 to 50. 9. A method of producing a transport fixing jig of claim 1 , comprising: applying an adhesive onto a first base material to form an applied layer; arranging a carbon nanotube aggregate on the applied layer; curing the applied layer to form an adhesive layer; and bonding the first base material and the carbon nanotube aggregate to each other via the adhesive layer, wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.

Assignees

Inventors

Classifications

  • the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

  • H10P72/135Primary

    characterised by a material, a roughness, a coating or the like · CPC title

  • using temporarily an auxiliary support · CPC title

  • for conveying, e.g. between different workstations · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11420832B2 cover?
Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein t…
Who is the assignee on this patent?
Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/7602. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 23 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).