Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
US2015338328A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015338328-A1 |
| Application number | US-201514717976-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 20, 2015 |
| Priority date | May 20, 2014 |
| Publication date | Nov 26, 2015 |
| Grant date | — |
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Official abstract text for this publication.
A substrate cleaning apparatus 1 includes a cleaning member 2 that abuts on a substrate W to scrub and clean the substrate W, a holding member 6 that holds the cleaning member 2 , an air cylinder 8 that generates force to press the cleaning member 2 against the substrate W, a displacement sensor 9 that measures a position of the holding member 6 , and a control device 11 that determines the replacement time of the cleaning member 2 based on the position of the holding member 6 . The position of the holding member 6 includes a cleaning position and a non-cleaning position. The control device 11 determines the replacement time of the cleaning member 2 from change in the cleaning position while a plurality of substrates W are continuously scrubbed and cleaned.
Opening claim text (preview).
What is claimed is: 1 . A substrate cleaning apparatus, comprising: a cleaning member that abuts on a substrate to scrub and clean the substrate; a holding means that holds the cleaning member; a pressing means that is provided in the holding means and generates force to press the cleaning member against the substrate; a position measuring means that is provided in the holding means and measures a position of the holding means; and a replacement time determining means th…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Electricity · mapped topic
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