Control of metallic contamination from metal-containing photoresist
US-2024036474-A1 · Feb 1, 2024 · US
Cleaning of wafer edges
Cleaning of wafer edges · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P70/54 |
| Official title | {Cleaning of wafer edges} |
| Display label | Cleaning of wafer edges |
| Total patents | 418 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 24 |
| 2016 | 18 |
| 2017 | 41 |
| 2018 | 31 |
| 2019 | 31 |
| 2020 | 49 |
| 2021 | 51 |
| 2022 | 50 |
| 2023 | 46 |
| 2024 | 36 |
| 2025 | 33 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Cleaning apparatus and substrate processing apparatus
US-2017372893-A1 · Dec 28, 2017 · US
Removing photoresist from a wafer
US-2017357158-A1 · Dec 14, 2017 · US
Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems
US-9809898-B2 · Nov 7, 2017 · US
Method of integration process for metal CMP
US-9805951-B1 · Oct 31, 2017 · US
Method of Integration Process for Metal CMP
US-2017301557-A1 · Oct 19, 2017 · US
Lower plasma-exclusion-zone rings for a bevel etcher
US-2017301566-A1 · Oct 19, 2017 · US
Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
US-9786527-B2 · Oct 10, 2017 · US
Substrate processing apparatus, liquid processing method, and storage medium
US-2017287699-A1 · Oct 5, 2017 · US
Substrate processing apparatus and processing method of substrate processing apparatus
US-2017287703-A1 · Oct 5, 2017 · US
Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning
US-2017256393-A1 · Sep 7, 2017 · US
Apparatus and method for treating substrates
US-2017221720-A1 · Aug 3, 2017 · US
Semiconductor device manufacturing method using a multilayer resist
US-9711344-B2 · Jul 18, 2017 · US
Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
US-2017170032-A1 · Jun 15, 2017 · US
Polishing apparatus and polishing method
US-9666440-B2 · May 30, 2017 · US
Substrate treatment method
US-9576787-B2 · Feb 21, 2017 · US
Methods for processing bevel edge etching
US-9564308-B2 · Feb 7, 2017 · US
Methods and apparatus for substrate edge cleaning
US-2017018441-A1 · Jan 19, 2017 · US
Substrate processing apparatus
US-2016372340-A1 · Dec 22, 2016 · US
Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing
US-9508575-B2 · Nov 29, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P70/54?
- CPC H10P70/54 is the Cooperative Patent Classification code for “Cleaning of wafer edges.”
- How many patents are filed under CPC H10P70/54 (Cleaning of wafer edges)?
- Our database includes 418 publications tagged with this CPC code.
- Is patent activity under CPC H10P70/54 growing?
- Publication counts under this code: 36 in 2024 vs 33 in 2025 (latest complete years).