Substrate treatment method

Patent metadata

Field	Value
Publication number	US-9576787-B2
Application number	US-201414248690-A
Country	US
Kind code	B2
Filing date	Apr 9, 2014
Priority date	Mar 30, 2010
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A substrate treatment method includes a substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having an opposing face to be opposed to a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the opposing face for filling a space defined between the lower surface of the substrate and the opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state; wherein the treatment liquid spreads outwardly over the lower surface of the substrate and further, flows around to a peripheral portion of an upper surface of the substrate.

First claim

What is claimed is:

1. A substrate treatment method of treating a peripheral portion of a substrate with a treatment liquid spouted from a first nozzle having an opposing face to be brought into opposed spaced relation to a lower surface of the substrate, the opposing face being smaller than the substrate in plan view, the method comprising:
a. a rotating step of rotating the substrate about a vertical axis;
b. a liquid filling step of supplying the treatment liquid to a space defined between the lower surface of the substrate and the opposing face from a treatment liquid spout provided in the opposing face to keep the space in a liquid filled state, the liquid filling step being performed simultaneously with the rotating step, wherein the liquid spout is supplied with the treatment liquid from a treatment liquid supply pipe which is connected to the first nozzle from underneath, and the opposing face is larger than the treatment liquid supply pipe in plan view;
c. a treatment liquid spreading step of allowing the treatment liquid in the space to be spread outward radially about the vertical axis over a region of the lower surface of the substrate not opposed to the opposing face, wherein the treatment liquid starts spreading from the space in the liquid filled state along the region of the lower surface of the substrate not opposed to the opposing face with the space in the liquid filled state, after said liquid filling step;
d. a step of allowing the treatment liquid to flow around from the lower surface to a peripheral portion of an upper surface of the substrate; and
e. a step of controlling a width of the peripheral portion of the upper surface of the substrate by controlling the substrate rotation in conjunction with the supply of treatment liquid to the first nozzle, so as to control an amount of the treatment liquid flowing around from the lower surface to the upper surface of the substrate to be generally uniform around the peripheral portion of the substrate.

2. The substrate treatment method according to claim 1 , wherein the opposing face includes a flat surface to be opposed to the lower surface of the substrate.

3. The substrate treatment method according to claim 1 , wherein a portion of the first nozzle including the opposing face is composed of a hydrophilic material.

4. The substrate treatment method according to claim 1 , wherein the opposing face includes an inner opposing surface provided with the treatment liquid spout, and an outer opposing surface provided annularly around the inner opposing surface and arranged to be brought into more closely opposed relation to the lower surface of the substrate than the inner surface,
the first nozzle has a recess defined by the inner opposing surface and surrounded by the outer opposing surface in plan view, and
the liquid filling step includes the step of supplying the treatment liquid from the treatment liquid spout to fill the recess.

5. The substrate treatment method according to claim 4 , wherein an inner diameter of the recess is smaller than a half of a diameter of the substrate.

6. The substrate treatment method according to claim 4 , wherein an inner diameter of the recess is approximately one third of a diameter of the substrate.

Assignees

• Dainippon Screen Mfg
• Screen Holdings Co Ltd

Inventors

• Kishimoto Takuya
• Ando Koji

Classifications

• H10P95/70

  Chemical treatments · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/54 Primary

  Cleaning of wafer edges · CPC title