Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing

Patent metadata

Field	Value
Publication number	US-9508575-B2
Application number	US-201414198150-A
Country	US
Kind code	B2
Filing date	Mar 5, 2014
Priority date	Mar 15, 2013
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.

First claim

The invention claimed is:

1. A particle cleaning module, comprising:
a housing;
a substrate holder disposed in the housing, the substrate holder configured to retain a substrate in a substantially vertical orientation, the substrate holder rotatable on a first axis;
a first pad holder disposed in the housing, the first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis;
a first actuator operable to move the first pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis;
a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis; and
a rotary arm assembly, comprising:
a rotary arm coupled with the first pad holder and operable for sweeping the first pad holder across a surface of a substrate; and
a lateral actuator mechanism for moving the rotary arm toward the substrate holder.

2. The particle cleaning module of claim 1 , further comprising:
a third pad holder disposed in the housing, the third pad holder having a pad retaining surface for holding a conditioning disk for conditioning a second pad held by the second pad holder, the third pad holder rotatable on a fourth axis parallel to the first axis and the second axis.

3. The particle cleaning module of claim 1 , wherein the pad retaining surface of the second pad holder is positioned to contact an exclusion region and/or edge portion of a substrate.

4. The particle cleaning module of claim 3 , wherein a centerline of the second pad holder is aligned with the exclusion region and/or edge portion of a substrate positioned on the substrate holder.

5. The particle cleaning module of claim 1 , further comprising:
a second actuator operable to move the second pad holder relative to the substrate holder to change a distance defined between the first axis and the third axis.

6. The particle cleaning module of claim 1 , further comprising:
a substrate receiver disposed in the housing, the substrate receiver having a substrate receiving slot configured to accept a substrate.

7. The particle cleaning module of claim 6 , wherein the substrate receiver is operable to move between a first position that is aligned with a centerline of the substrate and a second position that is clear of the substrate.

8. The particle cleaning module of claim 1 , wherein the first pad holder has a diameter less than a diameter of the substrate holder.

9. The particle cleaning module of claim 1 , wherein the second pad holder has a diameter less than a diameter of the substrate holder.

10. The particle cleaning module of claim 1 , wherein the second pad holder has a diameter one eighth of a diameter of the substrate holder.

11. The particle cleaning module of claim 1 , wherein the substrate holder is an electrostatic chuck or a vacuum chuck.

12. The particle cleaning module of claim 1 , further comprising:
a substrate rotation mechanism, operable to rotate the substrate holder about the first axis and coupled to the substrate holder by a first shaft.

13. The particle cleaning module of claim 1 , further comprising:
a plurality of spray bars disposed in the housing and configured to dispense a cleaning fluid in the housing.

14. The particle cleaning module of claim 1 , wherein the housing further comprises a lid configured to allow a robot in and out of the housing.

15. The particle cleaning module of claim 1 , further comprising:
a pocket coupled to the housing and configured to receive the first pad holder.

16. The particle cleaning module of claim 1 , wherein the first pad holder further comprises a first fluid delivery nozzle.

17. The particle cleaning module of claim 16 , wherein the second pad holder further comprises a second fluid delivery nozzle.

18. The particle cleaning module of claim 1 , wherein the second pad holder holds a fixed-abrasive pad.

Assignees

• Applied Materials Inc

Inventors

• Chen Hui
• Ko Sen-Hou

Classifications

• H10P95/062

  involving a dielectric removal step · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title