Plasma treatment method, plasma treatment apparatus, and semiconductor device manufacturing method
US-10074517-B2 · Sep 11, 2018 · US
Cleaning before device manufacture, i.e. Begin-Of-Line process
Cleaning before device manufacture, i.e. Begin-Of-Line process · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P70/10 |
| Official title | {Cleaning before device manufacture, i.e. Begin-Of-Line process} |
| Display label | Cleaning before device manufacture, i.e. Begin-Of-Line process |
| Total patents | 248 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 18 |
| 2017 | 11 |
| 2018 | 23 |
| 2019 | 33 |
| 2020 | 28 |
| 2021 | 38 |
| 2022 | 26 |
| 2023 | 23 |
| 2024 | 25 |
| 2025 | 11 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing apparatus and substrate processing method
US-2018254180-A1 · Sep 6, 2018 · US
Substrate processing apparatus and substrate processing method
US-2018240684-A1 · Aug 23, 2018 · US
Manufacture method of AMOLED pixel drive circuit
US-10056445-B2 · Aug 21, 2018 · US
Substrate treatment method and substrate treatment device
US-2018226244-A1 · Aug 9, 2018 · US
Methodology for forming a resistive element in a superconducting structure
US-2018212134-A1 · Jul 26, 2018 · US
Manufacture method of amoled pixel drive circuit
US-2018204897-A1 · Jul 19, 2018 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2018200764-A1 · Jul 19, 2018 · US
Binary metal oxide based interlayer for high mobility channels
US-2018175156-A1 · Jun 21, 2018 · US
Methods for silicide formation
US-2018166288-A1 · Jun 14, 2018 · US
Method of cleaning substrate processing apparatus and system of cleaning substrate processing apparatus
US-2018158699-A1 · Jun 7, 2018 · US
Array substrate manufactured by reduced times of patterning processes manufacturing method thereof and display apparatus
US-9991295-B2 · Jun 5, 2018 · US
Apparatus and method of treating surface of semiconductor substrate
US-9991111-B2 · Jun 5, 2018 · US
Substrate treatment system, substrate transfer method and computer storage medium
US-9984905-B2 · May 29, 2018 · US
Substrate treatment system, substrate transfer method and computer storage medium
US-9984904-B2 · May 29, 2018 · US
Binary metal oxide based interlayer for high mobility channels
US-9972695-B2 · May 15, 2018 · US
Semiconductor Devices and FinFETS
US-2018122946-A1 · May 3, 2018 · US
Method for pretreatment of base substrate and method for manufacturing layered body using pretreated base substrate
US-9896780-B2 · Feb 20, 2018 · US
Binary metal oxide based interlayer for high mobility channels
US-2018040708-A1 · Feb 8, 2018 · US
Binary metal oxide based interlayer for high mobility channels
US-2018040709-A1 · Feb 8, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P70/10?
- CPC H10P70/10 is the Cooperative Patent Classification code for “Cleaning before device manufacture, i.e. Begin-Of-Line process.”
- How many patents are filed under CPC H10P70/10 (Cleaning before device manufacture, i.e. Begin-Of-Line process)?
- Our database includes 248 publications tagged with this CPC code.
- Is patent activity under CPC H10P70/10 growing?
- Publication counts under this code: 25 in 2024 vs 11 in 2025 (latest complete years).