Substrate processing apparatus, substrate processing method and recording medium

Patent metadata

Field	Value
Publication number	US-2018200764-A1
Application number	US-201815871265-A
Country	US
Kind code	A1
Filing date	Jan 15, 2018
Priority date	Jan 17, 2017
Publication date	Jul 19, 2018
Grant date	—

Abstract

Contamination of a bottom surface of a substrate caused by a processing liquid used for cleaning a top surface of the substrate can be suppressed. After performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by a substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, a control unit 18 stops a supply of the processing liquid onto the top surface of the substrate by a processing liquid supply device 73 , and then, stops a supply of the processing liquid onto the bottom surface of the substrate by a processing liquid supply device 71.

First claim

We claim:

1 . A substrate processing apparatus configured to perform a liquid processing on a substrate by supplying a processing liquid onto the substrate, the substrate processing apparatus comprising:
a substrate holding/rotating unit configured to hold and rotate the substrate; a first processing liquid supply device configured to supply the processing liquid onto a top surface of the substrate; a second processing liquid supply device configured to supply the processing liquid onto a bottom surface of the substrate; and a control unit configured to control processings using the first processing liquid supply device and the second processing liquid supply device, wherein, after performing the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by the substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, the control unit stops a supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device first, and after that, stops a supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device.

2 . The substrate processing apparatus of claim 1 ,
wherein the control unit stops the supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device after the supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device is stopped and a remaining processing liquid thereon is removed from the top surface of the substrate by a centrifugal force generated through a rotation of the substrate.

3 . The substrate processing apparatus of claim 1 ,
wherein, when starting the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, the control unit starts the supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device first, and after that, starts the supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device.

4 . The substrate processing apparatus of claim 2 ,
wherein, when starting the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, the control unit starts the supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device first, and after that, starts the supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device.

5 . The substrate processing apparatus of claim 1 , further comprising:
a brush, having a cleaning body, configured to clean the substrate by bringing the cleaning body into contact with the top surface of the substrate and rotating the cleaning body when performing the liquid processing on the top surface of the substrate, wherein a peripheral portion of the cleaning body of the brush has an outwardly bent shape when viewed from a side.

6 . The substrate processing apparatus of claim 1 ,
wherein the substrate holding/rotating unit comprises: a base plate configured to rotate the substrate; a supporting member provided on the base plate and configured to support the substrate; and multiple guide pins provided on the supporting member and configured to guide the substrate, which is transferred from an outside of the apparatus, to a position where the substrate is supported by the supporting member, wherein each of the multiple guide pins has a groove extended in a direction intersecting with a periphery of the base plate, and the groove is inclined toward a direction of the processing liquid flowing on a periphery of the substrate during the liquid processing.

7 . The substrate processing apparatus of claim 1 , further comprising:
a recovery cup configured to collect the processing liquid scattered from the substrate being rotated; a gas supply device configured to supply a gas to form a downflow from above the substrate; a gas exhaust port configured to exhaust an air flow generated as the downflow is introduced into the recovery cup; and a flow rectifying member provided between the substrate holding/rotating unit and the recovery cup and configured to rectify the air flow such that the air flow heads toward the gas exhaust port, wherein the substrate holding/rotating unit comprises a base plate configured to rotate the substrate, an outer peripheral end of the base plate is located at a side outer than an edge portion of the substrate, and an upper end of the flow rectifying member is located at a position lower than the outer peripheral end of the base plate.

8 . A substrate processing method of performing a liquid processing on a substrate by supplying a processing liquid onto the substrate, the substrate processing method comprising:
a processing liquid supplying process of performing the liquid processing on a top surface of the substrate and the liquid processing on a bottom surface of the substrate in parallel by supplying the processing liquid onto the top surface of the substrate and supplying the processing liquid onto the bottom surface of the substrate while holding and rotating the substrate; a first ending process of ending the supplying of the processing liquid onto the top surface of the substrate after the processing liquid supplying process; and a second ending process of ending the supplying of the processing liquid onto the bottom surface of the substrate after the first ending process.

9 . The substrate processing method of claim 8 ,
wherein, in the second ending process, the supplying of the processing liquid onto the bottom surface of the substrate is ended after the supplying of the processing liquid onto the top surface of the substrate is ended and then the remaining processing liquid thereon is removed from the top surface of the substrate by a centrifugal force generated through a rotation of the substrate.

10 . The substrate processing method of claim 8 , further comprising:
a first starting process of starting the supplying of the processing liquid onto the bottom surface of the substrate when starting the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate; and a second starting process of starting the supplying of the processing liquid onto the top surface of the substrate after the first starting process.

11 . The substrate processing method of claim 9 , further comprising:
a first starting process of starting the supplying of the processing liquid onto the bottom surface of the substrate when starting the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate; and a second starting process of starting the supplying of the processing liquid onto the top surface of the substrate after the first starting process.

12 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a substrate processing method as claimed in claim 8 to be performed.

Assignees

• Tokyo Electron Ltd

Inventors

• Fukui Shogo
• Uchida Noritaka
• Obaru Takanori
• Shinohara Hidetaka
• Nishikido Shuuichi
• Ura Tomohito
• Motoyama Yuya

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title