Copper/ceramic bonded body and insulating circuit substrate
US-2024203819-A1 · Jun 20, 2024 · US
by the use of a metallic or inorganic thin film adhesion layer
by the use of a metallic or inorganic thin film adhesion layer · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/388 |
| Official title | {by the use of a metallic or inorganic thin film adhesion layer} |
| Display label | by the use of a metallic or inorganic thin film adhesion layer |
| Total patents | 384 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 32 |
| 2016 | 32 |
| 2017 | 25 |
| 2018 | 25 |
| 2019 | 29 |
| 2020 | 38 |
| 2021 | 40 |
| 2022 | 43 |
| 2023 | 40 |
| 2024 | 44 |
| 2025 | 26 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device and method for manufacturing the same
US-2016381795-A1 · Dec 29, 2016 · US
Light emitting element module
US-2016381782-A1 · Dec 29, 2016 · US
Ceramic circuit board
US-2016358840-A1 · Dec 8, 2016 · US
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US-9504144-B2 · Nov 22, 2016 · US
Stress-reduced circuit board and method for forming the same
US-9468091-B2 · Oct 11, 2016 · US
Metallized substrate, metal paste composition, and method for manufacturing metallized substrate
US-9462698-B2 · Oct 4, 2016 · US
Substrate via filling
US-9433101-B2 · Aug 30, 2016 · US
Copper foil with carrier
US-2016242281-A1 · Aug 18, 2016 · US
Cleaning composition and method of manufacturing metal wiring using the same
US-2016230289-A1 · Aug 11, 2016 · US
Flexible Circuit Electrode Array
US-2016228695-A1 · Aug 11, 2016 · US
Substrate via filling
US-2016219715-A1 · Jul 28, 2016 · US
Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board
US-2016212836-A1 · Jul 21, 2016 · US
Method for producing ceramic circuit board
US-2016192503-A1 · Jun 30, 2016 · US
Production method of metallized substrate
US-9374893-B2 · Jun 21, 2016 · US
High-speed interconnects for printed circuit boards
US-2016174364-A1 · Jun 16, 2016 · US
Method Of Forming Conductive Trace
US-2016174386-A1 · Jun 16, 2016 · US
Mounting device and method of manufacturing the same
US-9363900-B2 · Jun 7, 2016 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2016157356-A1 · Jun 2, 2016 · US
Composite laminate and electronic device
US-2016152004-A1 · Jun 2, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/388?
- CPC H05K3/388 is the Cooperative Patent Classification code for “by the use of a metallic or inorganic thin film adhesion layer.”
- How many patents are filed under CPC H05K3/388 (by the use of a metallic or inorganic thin film adhesion layer)?
- Our database includes 384 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/388 growing?
- Publication counts under this code: 44 in 2024 vs 26 in 2025 (latest complete years).